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Name: 5SGXEB6R3F40I4N
Brand: Intel
SKU: 5SGXEB6R3F40I4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R3F40I4N

Part No.:: 5SGXEB6R3F40I4N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB6R3F40I4N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 3808

Quantity:: Add To Cart

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5SGXEB6R3F40I4N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R3F40I4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R3F40I4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R3F40I4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R3F40I4N information

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5SGXEB6R3F40I4N Application Introduction

5SGXEB6R3F40I4N is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering abundant logic resources, high-speed transceivers, and embedded memory blocks for complex digital designs.

Application Scenario:

In telecommunications infrastructure, 5SGXEB6R3F40I4N can be utilized to implement advanced signal processing algorithms for baseband processing in wireless communication systems.

Design Optimization:

To effectively utilize 5SGXEB6R3F40I4N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption in 5SGXEB6R3F40I4N-based designs. Utilize power gating, voltage scaling, and dynamic power management strategies to optimize power usage during different operating modes.

2. Signal Integrity:

Ensure signal integrity in high-speed designs by carefully planning the routing of critical signals and utilizing impedance matching techniques for transmission lines connected to 5SGXEB6R3F40I4N. Proper termination and signal conditioning circuits should be employed to mitigate reflections and noise.

3. Thermal Management:

Prevent overheating and ensure reliable operation of 5SGXEB6R3F40I4N by implementing effective thermal management techniques. Utilize heat sinks, thermal vias, and fans for heat dissipation, and ensure adequate airflow within the system enclosure to maintain acceptable operating temperatures.

4. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier implementation and debugging on 5SGXEB6R3F40I4N. Utilize hierarchical design methodologies to organize the logic hierarchy efficiently and enable easier integration and verification of individual modules.

5. Resource Utilization:

Optimize the utilization of logic resources, memory blocks, and DSP (Digital Signal Processing) blocks available in 5SGXEB6R3F40I4N. Employ advanced synthesis and optimization techniques to minimize logic duplication, reduce resource wastage, and maximize the performance of the FPGA design.

Considerations:

When designing with 5SGXEB6R3F40I4N, it's essential to consider:

- Timing Closure: Ensure that the design meets timing constraints to achieve reliable operation at the desired clock frequency.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the intellectual property and integrity of the FPGA design.

- Design Verification: Thoroughly verify the functionality and performance of the design through simulation, emulation, and prototyping to detect and address any potential issues before deployment.

- Design Documentation: Maintain comprehensive documentation detailing the design specifications, implementation details, and verification results to facilitate collaboration and future maintenance.

5SGXEB6R3F40I4N FAQ

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3. Are the 5SGXEB6R3F40I4N price and inventory displayed accurate?

The price and inventory of 5SGXEB6R3F40I4N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB6R3F40I4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R3F40I4N we delivered, we will accept the replacement or return of the 5SGXEB6R3F40I4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R3F40I4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations