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Name: 5SGXEB6R3F40I3N
Brand: Intel
SKU: 5SGXEB6R3F40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R3F40I3N

Part No.:: 5SGXEB6R3F40I3N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB6R3F40I3N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2224

Quantity:: Add To Cart

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5SGXEB6R3F40I3N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R3F40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R3F40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R3F40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R3F40I3N information

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5SGXEB6R3F40I3N Application Introduction

5SGXEB6R3F40I3N is a high-capacity FPGA (Field-Programmable Gate Array) suitable for complex digital design projects, offering abundant logic resources, high-speed transceivers, and advanced DSP capabilities.

Application Scope:

In telecommunications infrastructure, 5SGXEB6R3F40I3N can be utilized to implement high-speed data processing and protocol handling, such as in base station units for cellular networks.

Design Guidelines:

To effectively utilize 5SGXEB6R3F40I3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption in 5SGXEB6R3F40I3N designs. Utilize power gating techniques and dynamic voltage/frequency scaling to minimize power usage during idle or low-load periods.

2. Signal Integrity:

Ensure signal integrity by carefully designing PCB layouts and using impedance-matched routing for high-speed interfaces, such as DDR memory interfaces or PCIe connections, in 5SGXEB6R3F40I3N-based systems. Employ signal termination and equalization techniques to mitigate signal distortion and improve reliability.

3. Thermal Management:

Manage thermal performance effectively to prevent overheating and ensure reliable operation of 5SGXEB6R3F40I3N devices. Use proper heatsinking solutions, thermal vias, and airflow optimization in the system enclosure to dissipate heat generated by the FPGA and associated components.

4. Design Partitioning:

Optimize design partitioning to maximize resource utilization and performance in 5SGXEB6R3F40I3N designs. Use hierarchical design methodologies and floorplanning techniques to allocate critical resources efficiently and minimize routing congestion.

5. Clock Management:

Implement robust clock management strategies to ensure timing closure and minimize clock skew in 5SGXEB6R3F40I3N designs. Utilize PLL (Phase-Locked Loop) circuits and clock tree synthesis techniques to generate stable clock signals and meet timing constraints across the entire design.

Considerations:

When designing with 5SGXEB6R3F40I3N, it's essential to consider:

- Resource Utilization: Optimize resource allocation to maximize FPGA utilization and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met, especially in high-speed designs.

- Design Reusability: Design modular and reusable components to facilitate future design iterations and reduce development time.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and ensure the integrity of 5SGXEB6R3F40I3N-based designs.

- Design Verification: Conduct extensive simulation and verification testing to validate the functionality, performance, and reliability of the 5SGXEB6R3F40I3N design under various operating conditions and corner cases.

5SGXEB6R3F40I3N FAQ

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3. Are the 5SGXEB6R3F40I3N price and inventory displayed accurate?

The price and inventory of 5SGXEB6R3F40I3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB6R3F40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R3F40I3N we delivered, we will accept the replacement or return of the 5SGXEB6R3F40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R3F40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations