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Name: 5SGXEB6R2F43I2N
Brand: Intel
SKU: 5SGXEB6R2F43I2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R2F43I2N

Part No.:: 5SGXEB6R2F43I2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB6R2F43I2N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3286

Quantity:: Add To Cart

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5SGXEB6R2F43I2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R2F43I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R2F43I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R2F43I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R2F43I2N information

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5SGXEB6R2F43I2N Application Introduction

5SGXEB6R2F43I2N is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced features and capabilities for a wide range of design projects.

Application Scenario:

In telecommunications infrastructure, 5SGXEB6R2F43I2N can be utilized to implement high-speed data processing and networking functionalities, such as packet processing and protocol handling in routers and switches.

Circuit Design:

To effectively utilize 5SGXEB6R2F43I2N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of 5SGXEB6R2F43I2N and associated circuitry. Utilize low-power modes and dynamic voltage scaling where applicable to achieve energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure robust signal integrity. Follow best practices for high-speed digital design, including controlled impedance traces, signal termination, and proper grounding to mitigate signal integrity issues.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 5SGXEB6R2F43I2N and prevent overheating. Utilize thermal vias, heat sinks, and fans to maintain optimal operating temperatures and prolong device lifespan.

4. Clock Distribution:

Design a stable and reliable clock distribution network to ensure precise timing synchronization across the FPGA fabric and connected peripherals. Use clock buffers, phase-locked loops (PLLs), and clock routing techniques to minimize clock skew and jitter.

5. Design Partitioning:

Partition the design into manageable modules and utilize hierarchical design techniques to facilitate easier debugging, testing, and maintenance. Implement proper interface protocols and bus architectures to enable efficient communication between different modules within the FPGA.

Considerations:

When optimizing the design with 5SGXEB6R2F43I2N, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize design performance and minimize resource constraints.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met, and the design operates reliably at the desired clock frequency.

- Security: Implement security features, such as device authentication and bitstream encryption, to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Verification: Rigorously verify the design through simulation, emulation, and prototyping to identify and address potential design flaws and ensure functional correctness before deployment.

- Future Scalability: Design the system with scalability in mind to accommodate future enhancements and upgrades, ensuring long-term viability and flexibility of the solution.

5SGXEB6R2F43I2N FAQ

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3. Are the 5SGXEB6R2F43I2N price and inventory displayed accurate?

The price and inventory of 5SGXEB6R2F43I2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB6R2F43I2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R2F43I2N we delivered, we will accept the replacement or return of the 5SGXEB6R2F43I2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R2F43I2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations