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Name: 5SGXEB6R2F43I2LN
Brand: Intel
SKU: 5SGXEB6R2F43I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB6R2F43I2LN

Part No.:: 5SGXEB6R2F43I2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB6R2F43I2LN.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3180

Quantity:: Add To Cart

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5SGXEB6R2F43I2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R2F43I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R2F43I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R2F43I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R2F43I2LN information

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5SGXEB6R2F43I2LN Application Introduction

5SGXEB6R2F43I2LN is a high-density FPGA (Field-Programmable Gate Array) device designed by Intel, offering a wide range of features and capabilities for complex digital designs.

Application Scenario:

In digital signal processing applications, 5SGXEB6R2F43I2LN can be utilized to implement advanced algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively use 5SGXEB6R2F43I2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption. Utilize the power-saving features available in 5SGXEB6R2F43I2LN, such as dynamic power gating and voltage scaling, to minimize power usage during idle or low-load conditions.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout and routing to minimize signal reflections, crosstalk, and electromagnetic interference. Utilize high-speed signal routing guidelines provided by Intel for optimal signal integrity.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure reliable operation of 5SGXEB6R2F43I2LN. Utilize thermal vias, heatsinks, and fans as necessary to dissipate heat generated during operation.

4. Clocking Strategy:

Design a robust clocking strategy to ensure synchronous operation and minimize clock skew. Utilize the advanced clocking resources available in 5SGXEB6R2F43I2LN, such as PLLs (Phase-Locked Loops) and DCMs (Digital Clock Managers), to generate and distribute clock signals with low jitter and skew.

5. Design Partitioning:

Break down the design into smaller, manageable modules to facilitate design verification, testing, and debugging. Utilize hierarchical design methodologies and IP (Intellectual Property) integration to reuse existing modules and accelerate development.

Considerations:

When optimizing the design with 5SGXEB6R2F43I2LN, keep the following considerations in mind:

- Resource Utilization: Optimize resource utilization to make efficient use of the available logic elements, memory blocks, and DSP (Digital Signal Processing) resources.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing requirements and achieves maximum performance.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access to the FPGA configuration.

- Debugging and Testing: Incorporate debug interfaces and testability features into the design to facilitate debugging and testing during development and deployment.

- Design Constraints: Adhere to design constraints, such as timing constraints, placement constraints, and routing constraints, to guide the synthesis, placement, and routing processes for optimal results.

5SGXEB6R2F43I2LN FAQ

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3. Are the 5SGXEB6R2F43I2LN price and inventory displayed accurate?

The price and inventory of 5SGXEB6R2F43I2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB6R2F43I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R2F43I2LN we delivered, we will accept the replacement or return of the 5SGXEB6R2F43I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R2F43I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations