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Name: 5SGXEB6R2F40I3N
Brand: Intel
SKU: 5SGXEB6R2F40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R2F40I3N

Part No.:: 5SGXEB6R2F40I3N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB6R2F40I3N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2437

Quantity:: Add To Cart

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5SGXEB6R2F40I3N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R2F40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R2F40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R2F40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R2F40I3N information

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5SGXEB6R2F40I3N Application Introduction

5SGXEB6R2F40I3N is a high-performance FPGA (Field Programmable Gate Array) device manufactured by Intel, featuring advanced capabilities for various design applications.

Application Scenario:

In digital signal processing (DSP) applications, 5SGXEB6R2F40I3N can be utilized to implement complex algorithms for tasks such as image processing, audio processing, and communications systems.

Circuit Design:

To effectively utilize 5SGXEB6R2F40I3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption and ensure reliable operation of 5SGXEB6R2F40I3N. Utilize power gating, dynamic voltage and frequency scaling (DVFS), and clock gating to minimize power usage during idle and low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal distortion. Pay attention to high-speed signal routing, impedance matching, and minimizing signal reflections to ensure reliable communication within the FPGA and with external components.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating of 5SGXEB6R2F40I3N. Use thermal vias, heat sinks, and proper airflow in the system enclosure to dissipate heat generated during operation and maintain optimal operating temperatures.

4. Resource Utilization:

Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP blocks, to maximize performance and minimize resource wastage. Utilize efficient coding techniques, such as pipelining, parallelism, and resource sharing, to make the most of the available hardware resources.

5. Design Validation:

Thoroughly validate the design through simulation, emulation, and hardware testing to ensure functionality, performance, and reliability. Use tools like ModelSim for simulation, FPGA prototyping platforms for emulation, and comprehensive test benches for hardware validation.

Considerations:

When designing with 5SGXEB6R2F40I3N, keep the following considerations in mind:

- Timing Closure: Ensure timing closure by properly constraining the design, optimizing clock domains, and minimizing clock skew to meet timing requirements.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property (IP) embedded within the FPGA and prevent unauthorized access or tampering.

- Design for Testability: Incorporate built-in self-test (BIST) and debug features into the design to facilitate testing, debugging, and troubleshooting during development and deployment phases.

- System Integration: Consider the interfacing requirements with other system components, such as sensors, actuators, and communication interfaces, and ensure seamless integration and compatibility with the FPGA design.

- Future Scalability: Design the system with scalability in mind to accommodate future enhancements, upgrades, and expansions while minimizing redesign efforts and costs.

5SGXEB6R2F40I3N FAQ

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3. Are the 5SGXEB6R2F40I3N price and inventory displayed accurate?

The price and inventory of 5SGXEB6R2F40I3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEB6R2F40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R2F40I3N we delivered, we will accept the replacement or return of the 5SGXEB6R2F40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R2F40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations