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Name: 5SGXEB6R1F43C2LG
Brand: Intel
SKU: 5SGXEB6R1F43C2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R1F43C2LG

Part No.:: 5SGXEB6R1F43C2LG

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2876

Quantity:: Add To Cart

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5SGXEB6R1F43C2LG Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB6R1F43C2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R1F43C2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R1F43C2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R1F43C2LG information

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Market and Application Analysis of 5SGXEB6R1F43C2LG

5SGXEB6R1F43C2LG is an advanced FPGA chip widely used in high-performance computing and embedded systems. It features a high-density architecture, extensive I/O capabilities, and optimized power consumption.

Application Scenario:

In the telecommunications industry, this chip can be utilized to implement complex signal processing algorithms and handle high-speed data transmission tasks.

Circuit Design:

To design a high-speed data processing system using 5SGXEB6R1F43C2LG, follow these steps:

1. Signal Interface Integration:

Connect high-speed transceivers to the I/O pins of 5SGXEB6R1F43C2LG. Ensure that the interface supports the required data rates and signal integrity, using appropriate coupling capacitors and termination resistors.

2. Memory Management:

Interface external memory modules, such as DDR3 or DDR4, with the chip to handle large data sets. Configure the memory controller IP cores within the FPGA to manage data read/write operations efficiently.

3. Processing Units:

Implement custom processing units using the FPGA's logic resources. Use high-level synthesis tools to convert algorithmic descriptions into hardware-accelerated processing blocks.

4. Power Distribution:

Design a robust power distribution network to supply stable power to 5SGXEB6R1F43C2LG and its peripherals. Utilize low-dropout regulators and decoupling capacitors to minimize noise and voltage fluctuations.

5. Thermal Management:

Integrate effective thermal management solutions, such as heat sinks or active cooling systems, to dissipate heat generated by the FPGA during operation. Ensure that the thermal design maintains the chip within safe operating temperatures.

Considerations:

When designing the system, it's crucial to consider:

- Signal Integrity: Proper layout techniques to minimize signal reflection, crosstalk, and electromagnetic interference.

- Timing Analysis: Perform thorough timing analysis to ensure that all critical paths meet the required performance criteria.

- Power Efficiency: Optimize power consumption by utilizing dynamic power management techniques and selecting low-power components.

- Reliability: Implement error detection and correction mechanisms to enhance system reliability, especially in mission-critical applications.

- Scalability: Design the system architecture to allow for future upgrades and scalability, accommodating increasing data processing demands.

5SGXEB6R1F43C2LG FAQ

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3. Are the 5SGXEB6R1F43C2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXEB6R1F43C2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R1F43C2LG we delivered, we will accept the replacement or return of the 5SGXEB6R1F43C2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R1F43C2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations