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Name: 5SGXEB5R3F43C3N
Brand: Intel
SKU: 5SGXEB5R3F43C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F43C3N

Part No.:: 5SGXEB5R3F43C3N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB5R3F43C3N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2208

Quantity:: Add To Cart

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5SGXEB5R3F43C3N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R3F43C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F43C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F43C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F43C3N information

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5SGXEB5R3F43C3N Application Introduction

5SGXEB5R3F43C3N is a high-performance FPGA (Field-Programmable Gate Array) widely used in advanced digital design projects, offering superior flexibility and computational capabilities.

Application Scenario:

In telecommunications infrastructure, 5SGXEB5R3F43C3N can be employed for tasks such as signal processing, protocol conversion, and network optimization.

Circuit Design:

To effectively utilize 5SGXEB5R3F43C3N in a digital design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption and ensure reliable operation. Utilize low-dropout regulators (LDOs) and power gating techniques to minimize power wastage and extend battery life in portable applications.

2. Signal Integrity:

Pay close attention to signal integrity to prevent signal degradation and ensure reliable data transmission. Use proper termination techniques, controlled impedance traces, and signal integrity analysis tools to mitigate signal integrity issues, especially in high-speed interfaces.

3. Thermal Management:

Manage thermal issues effectively to prevent overheating and maintain FPGA reliability. Incorporate thermal vias, heat sinks, and proper airflow designs to dissipate heat efficiently and ensure optimal operating temperatures.

4. Timing Constraints:

Optimize timing constraints to meet design requirements and ensure proper functionality. Utilize timing analysis tools to identify critical paths, optimize clock frequencies, and minimize setup and hold time violations for reliable operation.

5. Resource Utilization:

Maximize resource utilization to leverage the full potential of 5SGXEB5R3F43C3N and minimize hardware overhead. Utilize advanced synthesis and optimization techniques to optimize logic utilization, reduce routing congestion, and improve overall performance.

Considerations:

When designing with 5SGXEB5R3F43C3N, it's essential to consider:

- Design Partitioning: Divide the design into manageable partitions to simplify development, improve scalability, and facilitate design reuse.

- Design Security: Implement security features, such as bitstream encryption and authentication mechanisms, to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototype testing to ensure functional correctness, performance optimization, and compliance with design specifications.

- Design Documentation: Maintain comprehensive design documentation, including block diagrams, timing diagrams, and constraint files, to facilitate design review, troubleshooting, and future modifications.

- Design for Testability: Incorporate built-in self-test (BIST) and debug features to simplify testing, diagnose faults, and improve overall reliability and manufacturability.

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6. What is the process for return or replacement of 5SGXEB5R3F43C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F43C3N we delivered, we will accept the replacement or return of the 5SGXEB5R3F43C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F43C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations