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Name: 5SGXEB5R3F43C2N
Brand: Intel
SKU: 5SGXEB5R3F43C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F43C2N

Part No.:: 5SGXEB5R3F43C2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB5R3F43C2N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3733

Quantity:: Add To Cart

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5SGXEB5R3F43C2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R3F43C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F43C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F43C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F43C2N information

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5SGXEB5R3F43C2N Application Introduction

5SGXEB5R3F43C2N is a high-density and high-performance FPGA (Field Programmable Gate Array), widely used in demanding applications such as data center acceleration, network processing, and high-performance computing.

Application Scenario:

In a data center environment, 5SGXEB5R3F43C2N can be utilized for tasks such as real-time data processing, encryption/decryption acceleration, and network packet filtering.

Circuit Design:

To effectively utilize 5SGXEB5R3F43C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 5SGXEB5R3F43C2N and associated components. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to optimize power usage.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout to minimize signal interference, crosstalk, and reflections. Properly terminate high-speed signal lines and use impedance-controlled routing to maintain signal integrity, especially for high-speed interfaces such as DDR4 memory interfaces.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEB5R3F43C2N and prevent overheating. Utilize heatsinks, thermal vias, and fans to ensure adequate cooling, especially in high-performance computing applications with prolonged operation at high temperatures.

4. Clocking:

Optimize clocking architecture to minimize clock skew and jitter, ensuring reliable operation of synchronous logic within 5SGXEB5R3F43C2N. Use PLLs (Phase-Locked Loops) and DLLs (Delay-Locked Loops) for clock generation and distribution, and carefully constrain timing to meet setup and hold requirements.

5. Design Partitioning:

Partition the design into smaller, manageable blocks to facilitate design iteration and debugging. Utilize hierarchical design methodologies and IP (Intellectual Property) cores to efficiently utilize the resources available in 5SGXEB5R3F43C2N and accelerate time-to-market.

Considerations:

When designing with 5SGXEB5R3F43C2N, it's essential to consider:

- Resource Utilization: Optimize resource usage to maximize the efficiency of 5SGXEB5R3F43C2N and minimize area utilization.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet the desired performance requirements.

- Functional Verification: Rigorously test and verify the functionality of the design using simulation, emulation, and hardware-in-the-loop (HIL) testing to ensure correct operation.

- Security: Implement security features such as secure boot, encryption, and access control mechanisms to protect sensitive data and intellectual property stored in 5SGXEB5R3F43C2N.

- Documentation: Maintain comprehensive documentation throughout the design process, including design specifications, schematics, timing constraints, and verification reports, to facilitate collaboration and future maintenance.

5SGXEB5R3F43C2N FAQ

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3. Are the 5SGXEB5R3F43C2N price and inventory displayed accurate?

The price and inventory of 5SGXEB5R3F43C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEB5R3F43C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F43C2N we delivered, we will accept the replacement or return of the 5SGXEB5R3F43C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F43C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations