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Name: 5SGXEB5R3F43C2LN
Brand: Intel
SKU: 5SGXEB5R3F43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F43C2LN

Part No.:: 5SGXEB5R3F43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB5R3F43C2LN.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2153

Quantity:: Add To Cart

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5SGXEB5R3F43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R3F43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F43C2LN information

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5SGXEB5R3F43C2LN Application Introduction

5SGXEB5R3F43C2LN is a high-performance FPGA device manufactured by Intel, offering extensive logic and memory resources suitable for a wide range of applications, including telecommunications, automotive, and aerospace industries.

Application Scenario:

In telecommunications, 5SGXEB5R3F43C2LN can be utilized to implement high-speed data processing and packet switching functionalities in network infrastructure equipment.

Circuit Design:

To optimize the design using 5SGXEB5R3F43C2LN, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation of 5SGXEB5R3F43C2LN. Utilize dynamic power gating and voltage scaling strategies to optimize power usage during different operating modes.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout to minimize signal distortion and crosstalk. Use impedance-controlled traces, proper termination techniques, and ground planes to maintain signal integrity, especially in high-speed interfaces.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEB5R3F43C2LN during operation. Use thermal vias, heatsinks, and fans to maintain the FPGA's temperature within safe operating limits and prevent thermal-induced performance degradation.

4. Design Partitioning:

Partition the design into smaller modules to facilitate parallel development and optimization. Utilize the rich logic resources and embedded memory blocks of 5SGXEB5R3F43C2LN efficiently by distributing the functionality across different logic elements for better performance and resource utilization.

5. Clock Management:

Implement robust clocking strategies to synchronize different modules within the design and meet timing constraints. Utilize built-in PLLs and clock networks of 5SGXEB5R3F43C2LN to generate and distribute clock signals with minimal skew and jitter.

Considerations:

When designing with 5SGXEB5R3F43C2LN, consider the following factors:

- Resource Utilization: Optimize the utilization of logic, memory, and DSP resources to maximize the performance and efficiency of the design.

- Timing Closure: Pay close attention to timing constraints and perform timing analysis to ensure that the design meets the required performance specifications.

- Design Constraints: Consider constraints such as I/O standards, package pinouts, and environmental conditions to ensure compatibility and reliability in the target application environment.

- Test and Validation: Develop comprehensive test benches and verification methodologies to validate the functionality and performance of the design under various operating conditions.

- Design Security: Implement security features and measures to protect the intellectual property and sensitive data stored within the 5SGXEB5R3F43C2LN device from unauthorized access or tampering.

5SGXEB5R3F43C2LN FAQ

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3. Are the 5SGXEB5R3F43C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEB5R3F43C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB5R3F43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F43C2LN we delivered, we will accept the replacement or return of the 5SGXEB5R3F43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations