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Name: 5SGXEB5R3F40I4N
Brand: Intel
SKU: 5SGXEB5R3F40I4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F40I4N

Part No.:: 5SGXEB5R3F40I4N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB5R3F40I4N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 3321

Quantity:: Add To Cart

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5SGXEB5R3F40I4N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB5R3F40I4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F40I4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F40I4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F40I4N information

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5SGXEB5R3F40I4N Application Introduction

5SGXEB5R3F40I4N is a high-performance FPGA device commonly utilized in complex digital design projects, offering ample resources and flexibility for diverse applications.

Power Management:

To effectively manage power consumption in a design featuring 5SGXEB5R3F40I4N, follow these guidelines:

1. Power Supply Design:

Design a robust power supply system to deliver stable voltages to the 5SGXEB5R3F40I4N FPGA and associated components. Utilize high-quality voltage regulators and decoupling capacitors to minimize voltage fluctuations and ensure reliable operation.

2. Dynamic Power Management:

Implement dynamic power management techniques, such as clock gating and power gating, to selectively disable or reduce power to unused or idle portions of the FPGA fabric. This helps in minimizing power consumption during low activity periods.

3. Low-Power Modes:

Exploit the low-power modes offered by the 5SGXEB5R3F40I4N FPGA to further reduce power consumption when the device is not actively processing data. Transition between different power modes based on the operational requirements of the design.

Signal Integrity:

Ensuring signal integrity is crucial for reliable operation in 5SGXEB5R3F40I4N-based designs. Consider the following techniques:

1. PCB Layout:

Design the PCB layout with careful attention to signal routing and impedance matching. Minimize signal traces' length and avoid crossing high-speed signals to mitigate signal integrity issues like reflections and crosstalk.

2. Signal Termination:

Properly terminate high-speed signal lines to minimize signal reflections and ensure signal integrity. Utilize techniques such as series termination resistors or parallel termination schemes depending on the specific requirements of the design.

3. Clock Distribution:

Implement robust clock distribution networks with controlled impedance to maintain signal integrity for clock signals. Use dedicated clock routing layers and clock buffers to minimize clock skew and jitter.

Thermal Management:

Effective thermal management is essential for preventing overheating and ensuring reliable operation of 5SGXEB5R3F40I4N-based designs. Consider the following strategies:

1. Heat Dissipation:

Design the PCB with sufficient thermal vias and thermal pads to facilitate heat dissipation from the 5SGXEB5R3F40I4N FPGA. Ensure adequate airflow and ventilation within the enclosure to dissipate heat effectively.

2. Thermal Analysis:

Conduct thermal analysis using simulation tools or thermal imaging techniques to identify hotspots on the PCB and FPGA. Optimize the placement of heat-generating components and consider adding heatsinks or heat spreaders for better thermal dissipation.

3. Temperature Monitoring:

Implement temperature monitoring sensors within the design to continuously monitor the FPGA's temperature. Use this data to dynamically adjust the FPGA's operating parameters or activate thermal management mechanisms when temperature thresholds are exceeded.

5SGXEB5R3F40I4N FAQ

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3. Are the 5SGXEB5R3F40I4N price and inventory displayed accurate?

The price and inventory of 5SGXEB5R3F40I4N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB5R3F40I4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F40I4N we delivered, we will accept the replacement or return of the 5SGXEB5R3F40I4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F40I4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations