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Name: 5SGXEB5R3F40I3N
Brand: Intel
SKU: 5SGXEB5R3F40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F40I3N

Part No.:: 5SGXEB5R3F40I3N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB5R3F40I3N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2722

Quantity:: Add To Cart

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5SGXEB5R3F40I3N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEB5R3F40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F40I3N information

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5SGXEB5R3F40I3N Application Introduction

5SGXEB5R3F40I3N is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced features and performance for demanding applications in various fields, including telecommunications, aerospace, and industrial automation.

Application Scope:

In telecommunications, 5SGXEB5R3F40I3N can be utilized for signal processing tasks such as modulation/demodulation, error correction, and protocol handling in high-speed communication systems.

Design Strategy:

To effectively utilize 5SGXEB5R3F40I3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 5SGXEB5R3F40I3N and associated components. Utilize dynamic power modes and voltage regulation techniques to optimize power usage during different operating states.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and ensure signal integrity. Properly terminate high-speed signal traces and minimize signal reflections by adhering to impedance control guidelines. Utilize high-quality connectors and transmission lines to maintain signal integrity throughout the system.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEB5R3F40I3N and prevent overheating. Utilize thermal vias, heat sinks, and fans to enhance heat dissipation and maintain optimal operating temperatures. Perform thermal analysis during the design phase to identify hotspots and optimize component placement for improved thermal performance.

4. Design Partitioning:

Partition the design into logical modules to optimize resource utilization and facilitate design scalability. Utilize hierarchical design techniques to manage complexity and enhance design reusability. Balance resource utilization across different regions of the FPGA to maximize performance and minimize routing congestion.

5. Clock Management:

Implement robust clocking architectures to ensure reliable timing synchronization and minimize clock skew. Utilize dedicated clock networks and PLLs (Phase-Locked Loops) to generate and distribute clock signals with low jitter and precise timing characteristics. Perform timing analysis to identify critical paths and optimize clock constraints for improved performance and reliability.

Considerations:

When designing with 5SGXEB5R3F40I3N, it's essential to consider:

- Design Constraints: Understand the device specifications and limitations to optimize design parameters such as logic utilization, routing congestion, and timing closure.

- Design Verification: Perform thorough functional verification and timing analysis to validate design functionality and performance under various operating conditions.

- Design Security: Implement security features such as encryption, authentication, and access control to protect intellectual property and prevent unauthorized access or tampering of the design.

- Design for Testability: Incorporate built-in self-test (BIST) features and testability enhancements to facilitate design debugging, diagnosis, and production testing.

5SGXEB5R3F40I3N FAQ

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3. Are the 5SGXEB5R3F40I3N price and inventory displayed accurate?

The price and inventory of 5SGXEB5R3F40I3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEB5R3F40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F40I3N we delivered, we will accept the replacement or return of the 5SGXEB5R3F40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations