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Name: 5SGXEB5R3F40C4N
Brand: Intel
SKU: 5SGXEB5R3F40C4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R3F40C4N

Part No.:: 5SGXEB5R3F40C4N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB5R3F40C4N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2763

Quantity:: Add To Cart

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5SGXEB5R3F40C4N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R3F40C4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F40C4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F40C4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F40C4N information

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5SGXEB5R3F40C4N Application Introduction

5SGXEB5R3F40C4N is a high-density FPGA (Field-Programmable Gate Array) with advanced features, suitable for a wide range of applications, including telecommunications, industrial automation, and aerospace.

Application Scenario:

In telecommunications, 5SGXEB5R3F40C4N can be utilized to implement high-speed data processing and routing functions in networking equipment, such as routers and switches.

Circuit Design:

To effectively utilize 5SGXEB5R3F40C4N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management solutions to ensure stable and clean power delivery to 5SGXEB5R3F40C4N and its associated peripherals. Utilize low-dropout voltage regulators and bypass capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches. Utilize controlled impedance traces for high-speed interfaces and incorporate signal termination techniques, such as series resistors, to improve signal integrity.

3. Thermal Management:

Ensure adequate thermal dissipation for 5SGXEB5R3F40C4N by incorporating heatsinks, thermal vias, and airflow management techniques in the system design. Monitor the junction temperature of the FPGA and implement dynamic thermal management strategies, such as clock throttling or power gating, to prevent overheating.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring reliable timing operation for critical synchronous circuits within 5SGXEB5R3F40C4N. Utilize low-skew clock distribution networks and clock conditioning circuits to achieve tight synchronization and maximum performance.

5. Configuration and Debugging:

Implement robust configuration and debugging interfaces for 5SGXEB5R3F40C4N, such as JTAG or PCIe, to facilitate FPGA programming and debugging during development and deployment phases. Utilize dedicated configuration pins and onboard debugging resources to streamline the design validation and debugging process.

Considerations:

When optimizing the design with 5SGXEB5R3F40C4N, keep in mind:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize design performance and minimize resource wastage.

- Timing Closure: Pay attention to timing constraints and perform thorough timing analysis to ensure that critical paths meet timing requirements and achieve reliable operation at the target clock frequency.

- Design Security: Implement design security measures, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access or tampering of the FPGA configuration.

- System Scalability: Design the system with scalability in mind to accommodate future expansion or upgrades, such as adding additional FPGA modules or integrating external peripherals seamlessly.

5SGXEB5R3F40C4N FAQ

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6. What is the process for return or replacement of 5SGXEB5R3F40C4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F40C4N we delivered, we will accept the replacement or return of the 5SGXEB5R3F40C4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F40C4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations