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Name: 5SGXEB5R3F40C2N
Brand: Intel
SKU: 5SGXEB5R3F40C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB5R3F40C2N

Part No.:: 5SGXEB5R3F40C2N

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXEB5R3F40C2N.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2575

Quantity:: Add To Cart

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5SGXEB5R3F40C2N Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R3F40C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R3F40C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R3F40C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R3F40C2N information

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5SGXEB5R3F40C2N Application Introduction

5SGXEB5R3F40C2N is a high-density and high-performance FPGA (Field-Programmable Gate Array) ideal for a wide range of applications, including telecommunications, data center acceleration, and high-performance computing.

Application Scenario:

In telecommunications infrastructure, 5SGXEB5R3F40C2N can be utilized for implementing advanced signal processing algorithms, such as error correction coding and modulation/demodulation schemes, to enhance the efficiency and reliability of communication systems.

Circuit Design:

To effectively utilize 5SGXEB5R3F40C2N in a design project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable voltage levels to 5SGXEB5R3F40C2N and its associated components. Utilize high-efficiency voltage regulators and decoupling capacitors to minimize power consumption and noise.

2. Signal Integrity:

Pay special attention to signal integrity considerations to maintain the quality of signals within the FPGA. Use proper termination techniques, impedance matching, and signal routing guidelines to mitigate signal degradation and ensure reliable data transmission.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEB5R3F40C2N during operation. Use heat sinks, thermal vias, and adequate airflow to prevent overheating and ensure optimal performance and reliability.

4. Design Partitioning:

Optimize the design partitioning to efficiently utilize the resources available in 5SGXEB5R3F40C2N. Distribute the logic, memory, and DSP blocks strategically to maximize resource utilization and performance.

5. Timing Closure:

Pay careful attention to timing constraints and perform thorough timing analysis to achieve timing closure in the design. Utilize advanced synthesis and optimization techniques to meet timing requirements and ensure proper functionality of the design.

Considerations:

When designing with 5SGXEB5R3F40C2N, consider the following:

- Resource Utilization: Optimize resource utilization to minimize resource wastage and maximize design efficiency.

- Design Reusability: Design the FPGA project with modularity and reusability in mind to facilitate future design iterations and enhancements.

- Testability: Implement comprehensive testing methodologies to verify the functionality, performance, and reliability of the design under various operating conditions.

- Security: Incorporate security features and protocols to protect the FPGA design from unauthorized access, tampering, or malicious attacks.

- Compliance: Ensure compliance with relevant industry standards and regulations governing FPGA-based designs, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards.

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3. Are the 5SGXEB5R3F40C2N price and inventory displayed accurate?

The price and inventory of 5SGXEB5R3F40C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB5R3F40C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R3F40C2N we delivered, we will accept the replacement or return of the 5SGXEB5R3F40C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R3F40C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations