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Name: 5SGXEB5R2F43C3N
Brand: Intel
SKU: 5SGXEB5R2F43C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB5R2F43C3N

Part No.:: 5SGXEB5R2F43C3N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB5R2F43C3N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3880

Quantity:: Add To Cart

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5SGXEB5R2F43C3N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R2F43C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R2F43C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R2F43C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R2F43C3N information

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5SGXEB5R2F43C3N Application Introduction

5SGXEB5R2F43C3N is a high-density FPGA device manufactured by Intel, offering powerful capabilities for complex digital designs in various applications.

Application Scenario:

In telecommunications infrastructure, 5SGXEB5R2F43C3N can be utilized to implement high-speed data processing and networking functionalities, such as in base station equipment for cellular networks.

Design Optimization:

To effectively utilize 5SGXEB5R2F43C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable operation of 5SGXEB5R2F43C3N and associated components. Utilize low-dropout voltage regulators and power sequencing circuits to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and ensure robust signal integrity. Utilize controlled impedance traces, signal termination techniques, and proper ground/power plane design to mitigate signal reflections and crosstalk.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEB5R2F43C3N and prevent overheating. Utilize thermal vias, heat sinks, and airflow optimization to maintain the device within its operating temperature range.

4. Clock Distribution:

Optimize clock distribution networks to ensure reliable and synchronous operation of the FPGA and connected peripherals. Use low-skew clock distribution techniques, such as differential routing and clock tree synthesis, to minimize clock jitter and skew.

5. Design Partitioning:

Break down the design into manageable partitions to facilitate efficient resource utilization and timing closure. Utilize hierarchical design methodologies and IP reuse to streamline development and improve design scalability.

Considerations:

When optimizing the design, it's essential to consider:

- Resource Utilization: Maximize the utilization of FPGA resources, such as logic cells, memory blocks, and DSP slices, to achieve the desired functionality while minimizing resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met and the design operates reliably at the target clock frequency.

- Design Debugging: Implement built-in self-test (BIST) features and debug interfaces to facilitate design verification and debugging during development and production.

- Security: Incorporate security features, such as bitstream encryption and authentication, to protect the intellectual property and ensure secure operation of the FPGA-based system.

- Design Validation: Conduct comprehensive design validation and testing, including functional verification, simulation, and hardware testing, to ensure the correctness and reliability of the final design.

5SGXEB5R2F43C3N FAQ

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3. Are the 5SGXEB5R2F43C3N price and inventory displayed accurate?

The price and inventory of 5SGXEB5R2F43C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB5R2F43C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R2F43C3N we delivered, we will accept the replacement or return of the 5SGXEB5R2F43C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R2F43C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations