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Name: 5SGXEB5R1F43C2LN
Brand: Intel
SKU: 5SGXEB5R1F43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB5R1F43C2LN

Part No.:: 5SGXEB5R1F43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB5R1F43C2LN.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3885

Quantity:: Add To Cart

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5SGXEB5R1F43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB5R1F43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB5R1F43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB5R1F43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB5R1F43C2LN information

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5SGXEB5R1F43C2LN Application Introduction

5SGXEB5R1F43C2LN is a high-performance FPGA (Field-Programmable Gate Array) chip designed by Intel, offering advanced capabilities for a wide range of applications, including telecommunications, aerospace, and industrial automation.

Application Scenario:

In telecommunications, 5SGXEB5R1F43C2LN can be utilized to implement complex signal processing algorithms for baseband processing in wireless communication systems.

Circuit Design:

To effectively utilize 5SGXEB5R1F43C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 5SGXEB5R1F43C2LN. Utilize power gating techniques and dynamic voltage scaling to adjust power supply levels based on the FPGA's workload.

2. Signal Integrity:

Design the PCB layout to minimize signal degradation and ensure high signal integrity. Use impedance-controlled routing for high-speed interfaces and employ techniques such as differential signaling to reduce electromagnetic interference (EMI) and crosstalk.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 5SGXEB5R1F43C2LN under varying environmental conditions. Use heatsinks, thermal vias, and proper airflow design to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate timing and synchronization within the FPGA design. Use dedicated clock routing resources and minimize clock skew to optimize performance.

5. Design Partitioning:

Partition the FPGA design into smaller, manageable modules to facilitate design debugging, testing, and optimization. Utilize hierarchical design methodologies to improve design scalability and maintainability.

Considerations:

When designing with 5SGXEB5R1F43C2LN, it's essential to consider:

- Resource Utilization: Optimize resource utilization to maximize the efficiency of the FPGA design and minimize resource contention.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing requirements and operates reliably at the desired clock frequency.

- Design Constraints: Apply appropriate design constraints, such as timing constraints and placement constraints, to guide the FPGA synthesis and place-and-route process for optimal results.

- Design Verification: Conduct comprehensive design verification and simulation to validate the functionality, performance, and reliability of the FPGA design before deployment.

- Design Iteration: Iterate the design process iteratively to refine the FPGA implementation and address any performance or functionality issues identified during testing and verification.

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6. What is the process for return or replacement of 5SGXEB5R1F43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB5R1F43C2LN we delivered, we will accept the replacement or return of the 5SGXEB5R1F43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB5R1F43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations