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Name: 5SGXEABN3F45C2LN
Brand: Intel
SKU: 5SGXEABN3F45C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEABN3F45C2LN

Part No.:: 5SGXEABN3F45C2LN

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEABN3F45C2LN.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2715

Quantity:: Add To Cart

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5SGXEABN3F45C2LN Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEABN3F45C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEABN3F45C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEABN3F45C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEABN3F45C2LN information

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5SGXEABN3F45C2LN Application Introduction

5SGXEABN3F45C2LN is a Field-Programmable Gate Array (FPGA) device manufactured by Intel, offering high-performance processing and flexible reconfigurability, making it suitable for a wide range of applications in embedded systems, telecommunications, and industrial automation.

Application Scenario:

In an industrial automation setting, 5SGXEABN3F45C2LN can be utilized to implement complex control and monitoring systems, such as robotic assembly lines or machine vision systems, providing real-time processing and customization capabilities.

Circuit Design:

To effectively utilize 5SGXEABN3F45C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal utilization of power resources and minimize power consumption. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to adjust power supply based on processing requirements.

2. Signal Integrity:

Pay attention to signal integrity considerations to maintain reliable communication and prevent data corruption. Employ proper impedance matching techniques, use differential signaling for high-speed interfaces, and incorporate termination resistors to minimize signal reflections.

3. Thermal Management:

Design effective thermal management solutions to dissipate heat generated by the 5SGXEABN3F45C2LN device and ensure reliable operation. Utilize heat sinks, thermal vias, and fans to facilitate heat dissipation and prevent overheating, especially in enclosed or high-temperature environments.

4. System Integration:

Integrate 5SGXEABN3F45C2LN seamlessly into the system architecture, ensuring compatibility with other components and peripherals. Pay attention to interface standards and protocols, such as PCIe, HDMI, or Ethernet, and utilize appropriate I/O standards and voltage levels for seamless communication.

5. Design Verification:

Thoroughly verify the design through simulation, emulation, and prototyping to identify and address potential issues early in the development cycle. Use tools like ModelSim for functional simulation and Quartus Prime for FPGA synthesis and implementation to ensure design correctness and performance optimization.

Considerations:

When designing with 5SGXEABN3F45C2LN, it's essential to consider:

- Resource Utilization: Optimize resource utilization to maximize the efficiency of the FPGA fabric and minimize area constraints.

- Timing Constraints: Ensure timing closure by properly constraining the design and performing timing analysis to meet critical path requirements.

- Security: Implement security features, such as encryption and authentication, to protect intellectual property and prevent unauthorized access to the FPGA design.

- Design Reusability: Design with modularity and reusability in mind to facilitate future iterations and modifications, enhancing overall development efficiency and scalability.

- Compliance: Ensure compliance with industry standards and regulations, such as ISO 9001 or IEC 61508, to meet quality and safety requirements for the target application.

5SGXEABN3F45C2LN FAQ

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3. Are the 5SGXEABN3F45C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEABN3F45C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEABN3F45C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEABN3F45C2LN we delivered, we will accept the replacement or return of the 5SGXEABN3F45C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEABN3F45C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations