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Name: 5SGXEABN2F45I2
Brand: Intel
SKU: 5SGXEABN2F45I2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEABN2F45I2

Part No.:: 5SGXEABN2F45I2

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEABN2F45I2.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3997

Quantity:: Add To Cart

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5SGXEABN2F45I2 Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEABN2F45I2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEABN2F45I2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEABN2F45I2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEABN2F45I2 information

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5SGXEABN2F45I2 Application Introduction

5SGXEABN2F45I2 is a high-performance FPGA (Field-Programmable Gate Array) device developed by Intel. It offers a wide range of features and capabilities suitable for various design projects, from telecommunications to industrial automation.

Application Scenario:

In telecommunications, 5SGXEABN2F45I2 can be utilized for implementing signal processing algorithms, such as modulation and demodulation, to enable efficient data transmission and reception in wireless communication systems.

Circuit Design:

To effectively utilize 5SGXEABN2F45I2 in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of resources and minimize power consumption. Utilize the power gating feature of 5SGXEABN2F45I2 to dynamically disable unused modules or blocks, reducing overall power consumption during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as noise, crosstalk, and signal attenuation. Use proper termination techniques, controlled impedance traces, and signal integrity analysis tools to ensure reliable data transmission within the FPGA and with external components.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain the optimal operating temperature of 5SGXEABN2F45I2. Use thermal vias, heat sinks, and fans to dissipate heat generated during operation. Place critical components strategically on the PCB to optimize airflow and heat dissipation.

4. Resource Utilization:

Optimize resource utilization by carefully mapping design modules to FPGA resources such as logic elements, memory blocks, and DSP slices. Utilize the hierarchical design methodology and resource sharing techniques to maximize the utilization of available resources and minimize resource conflicts.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier implementation, verification, and debugging. Utilize the hierarchical design approach to divide the design into functional blocks with well-defined interfaces, allowing for independent development and testing of each module.

Considerations:

When designing with 5SGXEABN2F45I2, it's essential to consider:

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met, avoiding timing violations and ensuring reliable operation of the design.

- Design Security: Implement security features such as encryption, authentication, and anti-tampering mechanisms to protect the intellectual property and sensitive data stored within the FPGA.

- Design Verification: Thoroughly verify the design using simulation, emulation, and hardware testing to ensure functionality, reliability, and compliance with design specifications.

- Design for Testability: Incorporate built-in self-test (BIST) circuits, test access mechanisms, and debug interfaces to facilitate testing, debugging, and fault isolation during the design validation phase.

5SGXEABN2F45I2 FAQ

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3. Are the 5SGXEABN2F45I2 price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXEABN2F45I2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEABN2F45I2 we delivered, we will accept the replacement or return of the 5SGXEABN2F45I2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEABN2F45I2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations