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Name: 5SGXEABN2F45C3N
Brand: Intel
SKU: 5SGXEABN2F45C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEABN2F45C3N

Part No.:: 5SGXEABN2F45C3N

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEABN2F45C3N.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2019

Quantity:: Add To Cart

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5SGXEABN2F45C3N Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEABN2F45C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEABN2F45C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEABN2F45C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEABN2F45C3N information

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5SGXEABN2F45C3N Application Introduction

5SGXEABN2F45C3N is a high-performance field-programmable gate array (FPGA) designed for various applications, including telecommunications, industrial automation, and automotive electronics. It offers a combination of high-speed processing, low power consumption, and programmable flexibility.

Application Scenario:

In a telecommunications application, 5SGXEABN2F45C3N can be utilized to implement signal processing algorithms for data transmission and reception in wireless communication systems.

Circuit Design:

To effectively utilize 5SGXEABN2F45C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement power management strategies to optimize the energy efficiency of 5SGXEABN2F45C3N and associated peripherals. Utilize power gating techniques and dynamic voltage scaling to minimize power consumption during idle and low-load periods.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout to minimize signal reflections, crosstalk, and electromagnetic interference. Use impedance matching techniques and proper termination schemes for high-speed interfaces connected to 5SGXEABN2F45C3N.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of 5SGXEABN2F45C3N in challenging environments. Incorporate heat sinks, thermal vias, and fans as necessary to maintain optimal operating temperatures.

4. Clocking:

Optimize clock distribution and routing to minimize clock skew and jitter, ensuring synchronous operation and maximum performance of 5SGXEABN2F45C3N-based designs. Use advanced clocking architectures, such as PLLs and DLLs, for precise clock generation and synchronization.

5. Design Partitioning:

Partition the design into manageable blocks to facilitate modular development and improve design scalability. Utilize hierarchical design methodologies to streamline the implementation process and enhance design reusability.

Considerations:

When optimizing the design with 5SGXEABN2F45C3N, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize design performance and minimize resource wastage.

- Timing Closure: Perform comprehensive timing analysis and optimization to ensure that all timing constraints are met, avoiding timing violations and potential design failures.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and reliability before deployment in a production environment.

- Security: Implement robust security features, such as encryption, authentication, and access control mechanisms, to protect sensitive data and intellectual property stored or processed by 5SGXEABN2F45C3N.

- Compliance: Ensure compliance with industry standards and regulations relevant to the target application, such as ISO 26262 for automotive safety or FCC regulations for electromagnetic compatibility (EMC).

5SGXEABN2F45C3N FAQ

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3. Are the 5SGXEABN2F45C3N price and inventory displayed accurate?

The price and inventory of 5SGXEABN2F45C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEABN2F45C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEABN2F45C3N we delivered, we will accept the replacement or return of the 5SGXEABN2F45C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEABN2F45C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations