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Name: 5SGXEA7N3F45C2N
Brand: Intel
SKU: 5SGXEA7N3F45C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7N3F45C2N

Part No.:: 5SGXEA7N3F45C2N

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEA7N3F45C2N.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2020

Quantity:: Add To Cart

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5SGXEA7N3F45C2N Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N3F45C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N3F45C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N3F45C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N3F45C2N information

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5SGXEA7N3F45C2N Application Introduction

5SGXEA7N3F45C2N is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel. It offers extensive logic resources, high-speed transceivers, and advanced DSP capabilities, making it suitable for a wide range of applications, including telecommunications, automotive, and aerospace.

Application Scenario:

In telecommunications infrastructure, 5SGXEA7N3F45C2N can be utilized to implement signal processing algorithms for wireless communication systems, such as baseband processing in 5G networks.

Circuit Design:

To effectively utilize 5SGXEA7N3F45C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 5SGXEA7N3F45C2N. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to adapt power usage to the workload dynamically.

2. Signal Integrity:

Pay attention to signal integrity during PCB layout and routing to mitigate signal degradation and ensure reliable data transmission within the FPGA and with external components. Use impedance-controlled traces, proper termination techniques, and signal integrity analysis tools to optimize signal integrity.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure long-term reliability of 5SGXEA7N3F45C2N. Incorporate thermal vias, heat sinks, and fans to dissipate heat generated during operation. Ensure proper airflow within the system enclosure to maintain acceptable operating temperatures.

4. Design Partitioning:

Partition the design into manageable modules to facilitate design reuse, debugging, and testing. Utilize hierarchical design methodologies to break down the design into functional blocks with well-defined interfaces, improving overall design scalability and maintainability.

5. Clock Management:

Implement robust clocking architectures to distribute clock signals efficiently and minimize clock skew within the FPGA. Utilize PLLs (Phase-Locked Loops) and DLLs (Delay-Locked Loops) for clock synthesis and distribution, ensuring stable and synchronized clock domains for reliable operation.

Considerations:

When optimizing the design using 5SGXEA7N3F45C2N, keep in mind the following considerations:

- Resource Utilization: Maximize the utilization of FPGA resources while avoiding resource contention and overutilization to ensure optimal performance and resource efficiency.

- Timing Closure: Perform comprehensive timing analysis and optimization to meet timing constraints and ensure proper operation of the design at the target clock frequency.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access or tampering with the FPGA design.

- Design Verification: Conduct thorough functional verification and testing to validate the correctness and robustness of the design, ensuring it meets the specified requirements and standards.

- Design for Testability: Incorporate built-in self-test (BIST) and other testability features into the design to facilitate manufacturing testing and diagnosis of faults, improving overall product quality and reliability.

5SGXEA7N3F45C2N FAQ

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6. What is the process for return or replacement of 5SGXEA7N3F45C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N3F45C2N we delivered, we will accept the replacement or return of the 5SGXEA7N3F45C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N3F45C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations