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Name: 5SGXEA7N3F45C2L
Brand: Intel
SKU: 5SGXEA7N3F45C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7N3F45C2L

Part No.:: 5SGXEA7N3F45C2L

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEA7N3F45C2L.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3080

Quantity:: Add To Cart

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5SGXEA7N3F45C2L Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N3F45C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N3F45C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N3F45C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N3F45C2L information

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5SGXEA7N3F45C2L Application Introduction

5SGXEA7N3F45C2L is a high-capacity field-programmable gate array (FPGA) manufactured by Intel, offering extensive logic resources and high-speed transceivers, making it suitable for a wide range of applications requiring complex digital logic and high-speed data processing.

Application Scenario:

In a telecommunications infrastructure project, 5SGXEA7N3F45C2L can be utilized for implementing advanced signal processing algorithms and high-speed data transmission protocols, enhancing network performance and reliability.

Circuit Design:

To optimize the design utilizing 5SGXEA7N3F45C2L, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation of 5SGXEA7N3F45C2L. Utilize power gating, clock gating, and dynamic voltage scaling to dynamically adjust power usage based on the operational requirements.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure signal integrity. Utilize techniques such as controlled impedance traces, proper ground and power plane distribution, and signal isolation to mitigate signal integrity issues and achieve reliable data transmission.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain optimal operating temperatures for 5SGXEA7N3F45C2L. Utilize heatsinks, thermal vias, and proper airflow design to dissipate heat efficiently and avoid thermal throttling, which can degrade performance and reliability.

4. Design Partitioning:

Partition the design into smaller functional blocks to maximize resource utilization and optimize performance. Utilize the hierarchical design approach to modularize the design, simplify integration, and facilitate incremental testing and verification.

5. Clock Management:

Implement robust clocking architectures to ensure synchronous operation and minimize clock skew and jitter. Utilize clock networks, PLLs, and clock domain crossing techniques to synchronize multiple clock domains and maintain timing integrity throughout the design.

Considerations:

When optimizing the design using 5SGXEA7N3F45C2L, consider the following factors:

- Resource Utilization: Efficiently utilize the available logic resources, DSP blocks, and transceivers to meet design requirements and minimize resource wastage.

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing constraints and achieves maximum operating frequency without violating setup and hold time requirements.

- Design Constraints: Consider design constraints such as maximum power consumption, board size limitations, and environmental conditions to ensure that the design meets performance, power, and form factor requirements.

- Validation and Testing: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and reliability before deployment in the target application.

5SGXEA7N3F45C2L FAQ

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3. Are the 5SGXEA7N3F45C2L price and inventory displayed accurate?

The price and inventory of 5SGXEA7N3F45C2L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA7N3F45C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N3F45C2L we delivered, we will accept the replacement or return of the 5SGXEA7N3F45C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N3F45C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations