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Name: 5SGXEA7N3F40C2N
Brand: Intel
SKU: 5SGXEA7N3F40C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7N3F40C2N

Part No.:: 5SGXEA7N3F40C2N

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 5SGXEA7N3F40C2N.pdf

Description:: IC FPGA 600 I/O 1517FBGA

In Stock:: 2601

Quantity:: Add To Cart

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5SGXEA7N3F40C2N Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N3F40C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N3F40C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N3F40C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N3F40C2N information

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5SGXEA7N3F40C2N Application Introduction

5SGXEA7N3F40C2N is a high-capacity FPGA (Field-Programmable Gate Array) ideal for demanding applications requiring high performance and flexibility in logic implementation.

Application Scenario:

In digital signal processing (DSP) applications, 5SGXEA7N3F40C2N can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 5SGXEA7N3F40C2N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 5SGXEA7N3F40C2N. Utilize power gating, dynamic voltage and frequency scaling (DVFS), and low-power design methodologies to optimize power usage.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing PCB layouts and signal routing to minimize signal distortion and crosstalk. Use impedance matching techniques and proper termination schemes to maintain signal integrity, especially in high-speed interfaces.

3. Thermal Management:

Manage the thermal performance of 5SGXEA7N3F40C2N by incorporating effective heat dissipation solutions such as heat sinks, fans, or thermal vias in the PCB design. Monitor temperature levels and implement thermal throttling mechanisms to prevent overheating and ensure reliable operation.

4. Clock Distribution:

Optimize clock distribution to ensure precise timing and synchronization within the FPGA design. Use clock buffering techniques, clock tree synthesis, and phase-locked loop (PLL) configurations to achieve stable and accurate clock signals throughout the system.

5. Resource Utilization:

Maximize resource utilization within 5SGXEA7N3F40C2N by efficiently mapping logic functions and optimizing the placement and routing of logic elements. Utilize hierarchical design methodologies, IP core integration, and logic synthesis optimizations to minimize resource usage and improve performance.

Considerations:

When designing with 5SGXEA7N3F40C2N, consider the following factors:

- Design Constraints: Understand and adhere to the device's timing, power, and resource constraints to ensure design compatibility and reliability.

- Design Iteration: Perform iterative design cycles and thorough testing to fine-tune design parameters and optimize performance and functionality.

- System Integration: Ensure seamless integration of 5SGXEA7N3F40C2N into the overall system architecture, including interfacing with external components and communication interfaces.

- Design Validation: Validate the design through simulation, emulation, and prototyping to verify functionality, performance, and compliance with project requirements.

- Documentation: Maintain comprehensive documentation of the design process, including design specifications, schematics, and test reports, to facilitate future maintenance and troubleshooting.

5SGXEA7N3F40C2N FAQ

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3. Are the 5SGXEA7N3F40C2N price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXEA7N3F40C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N3F40C2N we delivered, we will accept the replacement or return of the 5SGXEA7N3F40C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N3F40C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations