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Name: 5SGXEA7N2F45C3
Brand: Intel
SKU: 5SGXEA7N2F45C3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA7N2F45C3

Part No.:: 5SGXEA7N2F45C3

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEA7N2F45C3.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3746

Quantity:: Add To Cart

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5SGXEA7N2F45C3 Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N2F45C3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N2F45C3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N2F45C3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N2F45C3 information

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5SGXEA7N2F45C3 Application Introduction

5SGXEA7N2F45C3 is a high-density and high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel. It offers a wide range of features and capabilities, making it suitable for diverse design projects across various industries.

Application Scenarios:

In telecommunications, 5SGXEA7N2F45C3 can be utilized for implementing advanced signal processing algorithms in wireless communication systems, such as 5G base stations or satellite communication terminals.

Circuit Design:

To effectively utilize 5SGXEA7N2F45C3 in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power utilization and minimize power consumption of the 5SGXEA7N2F45C3 device and associated peripherals. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) algorithms to adapt power usage based on workload.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal distortions. Pay attention to signal routing, impedance matching, and minimizing signal reflections to ensure reliable communication between components and avoid timing issues in the FPGA design.

3. Thermal Management:

Implement effective thermal management solutions to prevent the 5SGXEA7N2F45C3 device from overheating. Utilize proper heat sinks, thermal vias, and airflow optimization techniques to dissipate heat efficiently and maintain optimal operating temperatures, thereby ensuring long-term reliability and performance stability.

4. Resource Utilization:

Optimize resource utilization within the 5SGXEA7N2F45C3 FPGA device by effectively partitioning the design, utilizing built-in IP cores, and maximizing the use of available logic elements, memory blocks, and DSP slices. Utilize advanced synthesis and optimization tools provided by the FPGA development environment to minimize resource wastage and maximize design efficiency.

5. Design Validation:

Thoroughly validate the FPGA design using simulation, emulation, and hardware testing methodologies to ensure functionality, performance, and reliability meet the project requirements. Perform timing analysis, functional verification, and stress testing to identify and address any design issues early in the development cycle, reducing time-to-market and improving overall project success.

Considerations:

When designing with 5SGXEA7N2F45C3, it's essential to consider:

- Design Constraints: Understand the device's limitations and design constraints, such as maximum clock frequency, resource utilization, and I/O requirements, to ensure the design meets performance targets.

- Design Security: Implement security features and measures, such as encryption, authentication, and secure boot mechanisms, to protect the FPGA design and intellectual property from unauthorized access and tampering.

- Design Iteration: Embrace iterative design practices and utilize feedback from testing and validation to continuously refine and improve the FPGA design, ensuring it meets evolving project requirements and performance goals.

- Documentation: Maintain comprehensive documentation throughout the design process, including design specifications, schematics, test plans, and implementation details, to facilitate collaboration, troubleshooting, and future maintenance of the project.

5SGXEA7N2F45C3 FAQ

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3. Are the 5SGXEA7N2F45C3 price and inventory displayed accurate?

The price and inventory of 5SGXEA7N2F45C3 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEA7N2F45C3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N2F45C3 we delivered, we will accept the replacement or return of the 5SGXEA7N2F45C3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N2F45C3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations