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Name: 5SGXEA7N2F45C2LN
Brand: Intel
SKU: 5SGXEA7N2F45C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7N2F45C2LN

Part No.:: 5SGXEA7N2F45C2LN

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEA7N2F45C2LN.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3929

Quantity:: Add To Cart

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5SGXEA7N2F45C2LN Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N2F45C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N2F45C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N2F45C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N2F45C2LN information

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5SGXEA7N2F45C2LN Application Introduction

5SGXEA7N2F45C2LN is a high-performance FPGA (Field-Programmable Gate Array) device designed by Intel, offering advanced capabilities for a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation.

Application Scenario:

In telecommunications, 5SGXEA7N2F45C2LN can be utilized for implementing high-speed data processing, protocol conversion, and signal modulation/demodulation in next-generation network infrastructure equipment.

Circuit Design:

To effectively utilize 5SGXEA7N2F45C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable operation and minimize power consumption of 5SGXEA7N2F45C2LN and associated components. Utilize low-dropout voltage regulators, power gating, and dynamic voltage scaling to optimize power efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Use proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity and maximize data transmission reliability.

3. Thermal Management:

Ensure effective heat dissipation and thermal stability of 5SGXEA7N2F45C2LN by incorporating proper heatsinking, thermal vias, and thermal analysis during PCB layout. Consider ambient temperature, airflow, and operating conditions to prevent overheating and ensure long-term reliability.

4. Design Partitioning:

Break down the design into smaller, manageable modules to facilitate parallel development and optimization. Utilize the hierarchical design approach to improve design scalability, reusability, and maintainability, while optimizing resource utilization and performance.

5. Clock Management:

Implement robust clock distribution and synchronization techniques to ensure accurate timing and synchronization of signals within 5SGXEA7N2F45C2LN-based designs. Use PLLs (Phase-Locked Loops), DLLs (Delay-Locked Loops), and clock skew optimization to meet timing requirements and minimize clock jitter.

Considerations:

When designing with 5SGXEA7N2F45C2LN, it's essential to consider:

- Resource Utilization: Optimize FPGA resource usage to maximize design efficiency and minimize resource conflicts.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and critical paths are optimized for maximum performance.

- Design Verification: Utilize simulation, emulation, and hardware-in-the-loop (HIL) testing techniques to verify design functionality, performance, and reliability before deployment.

- Design Security: Implement security features, such as encryption, authentication, and access control, to protect intellectual property and prevent unauthorized access or tampering with the design.

- Design Documentation: Maintain comprehensive design documentation, including schematics, PCB layouts, timing constraints, and design specifications, to facilitate design review, debugging, and future modifications.

5SGXEA7N2F45C2LN FAQ

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3. Are the 5SGXEA7N2F45C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEA7N2F45C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEA7N2F45C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N2F45C2LN we delivered, we will accept the replacement or return of the 5SGXEA7N2F45C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N2F45C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations