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Name: 5SGXEA7N1F45C2LG
Brand: Intel
SKU: 5SGXEA7N1F45C2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7N1F45C2LG

Part No.:: 5SGXEA7N1F45C2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3781

Quantity:: Add To Cart

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5SGXEA7N1F45C2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7N1F45C2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7N1F45C2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7N1F45C2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7N1F45C2LG information

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5SGXEA7N1F45C2LG Application Introduction

5SGXEA7N1F45C2LG is a high-performance FPGA, widely used in complex digital logic designs due to its advanced features and capabilities. It offers significant computational power, high-speed I/O, and flexibility for various applications.

Design Optimization Tips:

1. Power Management:

Effective power management is crucial for ensuring the stability and efficiency of your design using 5SGXEA7N1F45C2LG. Utilize dynamic voltage and frequency scaling (DVFS) techniques to adjust the power consumption based on the computational load. Implement power gating to disable unused logic blocks and reduce leakage power. Ensure proper decoupling and bypass capacitors are placed close to the power pins to minimize noise and voltage fluctuations.

2. Signal Integrity:

Maintaining signal integrity is essential for high-speed designs involving this chip. Use controlled impedance traces for critical signals and differential pairs for high-speed data lines. Implement proper termination techniques to match the impedance of the signal traces and avoid reflections. Minimize crosstalk by maintaining adequate spacing between signal traces and using ground planes to isolate them. Utilize signal integrity simulation tools to verify the integrity of your signals before finalizing the design.

3. Thermal Management:

Proper thermal management ensures the reliable operation of 5SGXEA7N1F45C2LG under various conditions. Use heat sinks or active cooling solutions to dissipate heat generated by the FPGA. Ensure that there is adequate airflow around the device to prevent hotspots. Implement thermal vias in the PCB design to transfer heat away from the FPGA to the ground plane or other cooling structures. Monitor the operating temperature using on-chip temperature sensors and adjust the cooling strategy accordingly.

4. PCB Layout:

A well-designed PCB layout is critical for optimizing the performance of this chip. Place decoupling capacitors close to the power pins of the FPGA to filter out noise. Route high-speed signals with controlled impedance and minimize the length of signal traces to reduce latency and signal degradation. Use a multi-layer PCB design to separate power, ground, and signal layers, improving signal integrity and reducing electromagnetic interference (EMI). Ensure that the power supply network is robust and can handle the current requirements of the FPGA.

Considerations:

When designing with 5SGXEA7N1F45C2LG, consider the following aspects:

- Power Supply Design: Ensure that the power supply design meets the voltage and current requirements of the FPGA, with adequate margin for load transients.

- Signal Timing: Verify that all signal timing requirements are met, especially for high-speed interfaces, to ensure reliable data transfer.

- Thermal Analysis: Perform thermal analysis to identify potential hotspots and design appropriate cooling solutions to maintain optimal operating temperatures.

- Reliability Testing: Conduct thorough testing to verify the reliability and robustness of the design under different operating conditions, including temperature and voltage variations.

By following these design optimization tips, you can effectively utilize 5SGXEA7N1F45C2LG in your projects, ensuring high performance, reliability, and efficiency.

5SGXEA7N1F45C2LG FAQ

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3. Are the 5SGXEA7N1F45C2LG price and inventory displayed accurate?

The price and inventory of 5SGXEA7N1F45C2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEA7N1F45C2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7N1F45C2LG we delivered, we will accept the replacement or return of the 5SGXEA7N1F45C2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7N1F45C2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations