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Name: 5SGXEA7K3F40C2LN
Brand: Intel
SKU: 5SGXEA7K3F40C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA7K3F40C2LN

Part No.:: 5SGXEA7K3F40C2LN

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 5SGXEA7K3F40C2LN.pdf

Description:: IC FPGA 696 I/O 1517FBGA

In Stock:: 3880

Quantity:: Add To Cart

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5SGXEA7K3F40C2LN Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
696
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7K3F40C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7K3F40C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7K3F40C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7K3F40C2LN information

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5SGXEA7K3F40C2LN Application Introduction

5SGXEA7K3F40C2LN is a high-performance FPGA (Field-Programmable Gate Array) from Intel, designed for demanding applications requiring high logic density, processing power, and flexibility.

Application Scenario:

In communications infrastructure, 5SGXEA7K3F40C2LN can be utilized for tasks such as protocol conversion, signal processing, and packet filtering in networking equipment.

Circuit Design:

To effectively utilize 5SGXEA7K3F40C2LN in a design project, consider the following steps:

1. Logic Implementation:

Utilize Quartus Prime software to design and implement the desired logic functions on 5SGXEA7K3F40C2LN. Employ techniques like pipelining, parallelism, and resource sharing to optimize logic usage and maximize performance.

2. Power Management:

Implement efficient power management techniques to minimize power consumption and heat generation. Utilize power gating, dynamic voltage and frequency scaling, and clock gating to selectively power down unused resources and reduce dynamic power consumption.

3. Signal Integrity:

Ensure signal integrity by carefully designing PCB layouts, minimizing signal skew, and incorporating termination resistors where necessary. Use differential signaling and impedance matching techniques to mitigate signal reflections and crosstalk.

4. Thermal Management:

Implement effective thermal management strategies to prevent overheating and ensure reliable operation of 5SGXEA7K3F40C2LN. Utilize heat sinks, thermal vias, and fans to dissipate heat efficiently. Optimize placement of high-power components and ensure adequate airflow within the enclosure.

5. Design Validation:

Thoroughly validate the design through simulation and prototyping to verify functionality, performance, and reliability. Perform timing analysis, functional simulation, and hardware-in-the-loop testing to ensure that the design meets specifications and operates correctly under various conditions.

Considerations:

When designing with 5SGXEA7K3F40C2LN, it's essential to consider:

- Resource Utilization: Optimize logic and memory usage to make efficient use of available resources and maximize design flexibility.

- Timing Closure: Pay close attention to timing constraints and ensure that all timing paths meet timing requirements to prevent timing violations and ensure proper operation of the design.

- Design Partitioning: Divide the design into manageable blocks or modules to facilitate easier development, debugging, and maintenance.

- Design Security: Implement security features such as encryption, authentication, and access control to protect intellectual property and prevent unauthorized access or tampering of the design.

- Design for Testability: Incorporate built-in self-test (BIST) circuits, debug interfaces, and test points to facilitate testing and debugging of the design during development and production phases.

5SGXEA7K3F40C2LN FAQ

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3. Are the 5SGXEA7K3F40C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEA7K3F40C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA7K3F40C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7K3F40C2LN we delivered, we will accept the replacement or return of the 5SGXEA7K3F40C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7K3F40C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations