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Name: 5SGXEA7H3F35I3LN
Brand: Intel
SKU: 5SGXEA7H3F35I3LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7H3F35I3LN

Part No.:: 5SGXEA7H3F35I3LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA7H3F35I3LN.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2838

Quantity:: Add To Cart

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5SGXEA7H3F35I3LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA7H3F35I3LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7H3F35I3LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7H3F35I3LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7H3F35I3LN information

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The application and technological advancement of 5SGXEA7H3F35I3LN in specific industries

5SGXEA7H3F35I3LN is a field-programmable gate array (FPGA) chip known for its high performance and versatility, commonly used in various industries for specialized applications. It features advanced logic elements, embedded memory blocks, and high-speed transceivers, making it ideal for demanding tasks in sectors such as telecommunications, aerospace, automotive, and medical devices.

Application Scenario:

In the telecommunications industry, 5SGXEA7H3F35I3LN plays a crucial role in implementing complex signal processing algorithms and high-speed data transmission protocols. It is utilized in base stations, routers, and network switches to handle the increasing demand for bandwidth and ensure reliable connectivity.

Circuit Design:

To design a high-performance telecommunications system using 5SGXEA7H3F35I3LN, consider the following steps:

1. Signal Processing:

Utilize the programmable logic resources of 5SGXEA7H3F35I3LN to implement custom signal processing algorithms for tasks such as modulation, demodulation, error correction, and channel equalization. Leverage the embedded DSP blocks for efficient arithmetic operations and filtering.

2. Protocol Implementation:

Implement communication protocols, such as Ethernet, PCIe, or JESD204B, using the high-speed transceivers available in 5SGXEA7H3F35I3LN. Configure the transceiver settings for optimal data rate, equalization, and jitter performance to ensure reliable data transmission.

3. Memory Management:

Integrate on-chip memory blocks, such as M20K or MLAB, for buffering, caching, and storing intermediate data during signal processing tasks. Optimize memory access patterns to minimize latency and maximize throughput.

4. Interface Design:

Design the interface circuitry to connect 5SGXEA7H3F35I3LN with external components, such as transceivers, PHYs, or external memory devices. Utilize high-speed serial interfaces, LVDS or SERDES, for interfacing with off-chip components and ensure signal integrity and impedance matching.

5. Power Management:

Implement efficient power supply and management circuitry to provide stable voltage levels to 5SGXEA7H3F35I3LN and minimize power consumption. Utilize power gating techniques, dynamic voltage scaling, and clock gating to optimize power usage based on the workload and operating conditions.

Considerations:

When designing with 5SGXEA7H3F35I3LN, consider the following factors:

- Performance Optimization: Utilize the architecture and resources of 5SGXEA7H3F35I3LN efficiently to meet the performance requirements of the telecommunications system while minimizing resource utilization and latency.

- Thermal Management: Implement proper heat dissipation techniques, such as heatsinks or thermal vias, to prevent overheating and ensure reliable operation of 5SGXEA7H3F35I3LN under high computational loads.

- Reliability and Security: Incorporate built-in self-test (BIST) features and error correction mechanisms to ensure the reliability of 5SGXEA7H3F35I3LN operation. Implement security measures, such as encryption and authentication, to protect sensitive data and prevent unauthorized access.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic interference (EMI) and electromagnetic compatibility (EMC), to guarantee interoperability and compatibility with other telecommunications equipment.

- Future Scalability: Design the telecommunications system with scalability in mind to accommodate future upgrades and expansions. Utilize the reconfigurability of 5SGXEA7H3F35I3LN to adapt to evolving standards and requirements in the telecommunications industry.

5SGXEA7H3F35I3LN FAQ

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6. What is the process for return or replacement of 5SGXEA7H3F35I3LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7H3F35I3LN we delivered, we will accept the replacement or return of the 5SGXEA7H3F35I3LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7H3F35I3LN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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