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Name: 5SGXEA7H3F35C3N
Brand: Intel
SKU: 5SGXEA7H3F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA7H3F35C3N

Part No.:: 5SGXEA7H3F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA7H3F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3111

Quantity:: Add To Cart

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5SGXEA7H3F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7H3F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7H3F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7H3F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7H3F35C3N information

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5SGXEA7H3F35C3N Application Introduction

5SGXEA7H3F35C3N is a high-density and high-performance field-programmable gate array (FPGA) device manufactured by Intel. It offers a wide range of resources and features, making it suitable for various applications in sectors like telecommunications, automotive, aerospace, and industrial automation.

Application Scenario:

In an automotive application, 5SGXEA7H3F35C3N can be utilized for real-time processing tasks such as advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI) systems, and engine control units (ECUs).

Design Optimization:

To effectively utilize 5SGXEA7H3F35C3N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize the power consumption of 5SGXEA7H3F35C3N and associated circuitry. Utilize power gating techniques, dynamic voltage and frequency scaling (DVFS), and low-power standby modes to minimize overall power consumption.

2. Signal Integrity:

Ensure robust signal integrity by carefully designing the PCB layout to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Use impedance matching techniques, proper termination schemes, and ground/power plane partitioning to maintain signal integrity and reliability.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXEA7H3F35C3N and prevent overheating. Utilize proper heatsinking, thermal vias, and airflow optimization techniques to maintain the FPGA's operating temperature within safe limits and ensure long-term reliability.

4. Resource Utilization:

Optimize the utilization of FPGA resources, such as logic elements (LEs), memory blocks, and DSP blocks, to maximize performance and efficiency. Utilize efficient coding practices, logic synthesis optimizations, and resource sharing techniques to minimize resource wastage and improve overall design efficiency.

5. Design for Testability:

Implement built-in self-test (BIST) features, boundary scan testing, and other design-for-testability (DFT) techniques to facilitate easy debugging, testing, and validation of 5SGXEA7H3F35C3N-based designs. Incorporate diagnostic features and remote monitoring capabilities to enable efficient fault detection and troubleshooting.

Considerations:

When optimizing the design, it's essential to consider:

- Timing Closure: Ensure that timing constraints are met to guarantee correct operation and avoid timing violations.

- Security: Implement security features such as encryption, authentication, and secure boot to protect sensitive data and intellectual property stored in the FPGA.

- Compliance: Ensure compliance with relevant industry standards and regulations, such as ISO 26262 for automotive safety or DO-254 for aerospace applications.

- Design Iteration: Iteratively refine the design through simulation, synthesis, and prototyping to achieve the desired performance, functionality, and reliability goals.

- Future Scalability: Design the system with scalability in mind to accommodate future enhancements, upgrades, and changes in requirements.

5SGXEA7H3F35C3N FAQ

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3. Are the 5SGXEA7H3F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXEA7H3F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEA7H3F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7H3F35C3N we delivered, we will accept the replacement or return of the 5SGXEA7H3F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7H3F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations