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Name: 5SGXEA7H2F35C3N
Brand: Intel
SKU: 5SGXEA7H2F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA7H2F35C3N

Part No.:: 5SGXEA7H2F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA7H2F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3526

Quantity:: Add To Cart

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5SGXEA7H2F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA7H2F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA7H2F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA7H2F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA7H2F35C3N information

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5SGXEA7H2F35C3N Application Introduction

5SGXEA7H2F35C3N is a high-performance FPGA chip manufactured by Intel, offering advanced features and capabilities for a wide range of design projects.

Application Scenario:

In digital signal processing applications, 5SGXEA7H2F35C3N can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 5SGXEA7H2F35C3N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal performance and minimal power consumption. Utilize power gating, dynamic voltage scaling, and low-power design methodologies to maximize energy efficiency.

2. Signal Integrity:

Design PCB layouts with careful consideration for signal integrity. Minimize signal reflections, crosstalk, and impedance mismatches by following best practices for high-speed digital design. Utilize impedance-controlled traces and proper termination techniques to maintain signal integrity.

3. Thermal Management:

Manage thermal issues effectively to prevent overheating and ensure reliable operation. Use proper heat sinking, thermal vias, and airflow optimization techniques to dissipate heat efficiently. Monitor temperatures during operation and implement thermal throttling mechanisms if necessary to prevent thermal runaway.

4. Resource Utilization:

Optimize resource utilization to make the most efficient use of 5SGXEA7H2F35C3N resources. Utilize advanced synthesis and optimization tools to minimize logic utilization, routing congestion, and resource conflicts. Explore pipelining, parallelism, and resource sharing techniques to maximize performance and resource efficiency.

5. Design Verification:

Thoroughly verify the design through simulation, emulation, and prototyping to ensure functionality and performance goals are met. Perform timing analysis, power analysis, and functional verification to validate the design against specifications. Use hardware-in-the-loop testing to verify real-world performance and compatibility with external systems.

Considerations:

When designing with 5SGXEA7H2F35C3N, keep in mind the following considerations:

- Timing Closure: Pay close attention to timing constraints and ensure proper timing closure to meet performance requirements.

- Design Security: Implement security features such as encryption, authentication, and anti-tampering mechanisms to protect intellectual property and prevent unauthorized access.

- System Integration: Consider interfacing with other components or systems and ensure compatibility through proper communication protocols and interface standards.

- Design Flexibility: Design the FPGA architecture with flexibility in mind to accommodate future updates, enhancements, or changes in requirements.

- Documentation and Collaboration: Maintain comprehensive documentation and collaborate effectively with team members and stakeholders to facilitate design review, debugging, and maintenance.

5SGXEA7H2F35C3N FAQ

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3. Are the 5SGXEA7H2F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXEA7H2F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA7H2F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA7H2F35C3N we delivered, we will accept the replacement or return of the 5SGXEA7H2F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA7H2F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations