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Name: 5SGXEA5N3F45C2L
Brand: Intel
SKU: 5SGXEA5N3F45C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA5N3F45C2L

Part No.:: 5SGXEA5N3F45C2L

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXEA5N3F45C2L.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2614

Quantity:: Add To Cart

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5SGXEA5N3F45C2L Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA5N3F45C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA5N3F45C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA5N3F45C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA5N3F45C2L information

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5SGXEA5N3F45C2L Application Introduction

5SGXEA5N3F45C2L is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering extensive programmable logic resources and high-speed interfaces suitable for a wide range of applications.

Application Scenario:

In digital signal processing (DSP) applications, 5SGXEA5N3F45C2L can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, and communications processing.

Design Optimization Techniques:

To effectively utilize 5SGXEA5N3F45C2L in a design project, consider the following optimization techniques:

1. Power Management:

Implement power-saving strategies such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) to optimize power consumption. Utilize the power management features available in 5SGXEA5N3F45C2L to dynamically adjust power usage based on workload and performance requirements.

2. Signal Integrity:

Ensure signal integrity by carefully designing high-speed interfaces, using techniques such as impedance matching, controlled impedance routing, and signal termination. Leverage built-in features of 5SGXEA5N3F45C2L like LVDS (Low-Voltage Differential Signaling) transceivers and on-chip termination resistors to enhance signal integrity.

3. Thermal Management:

Optimize thermal performance by incorporating proper heat sinking, thermal vias, and airflow considerations into the PCB (Printed Circuit Board) layout. Utilize thermal analysis tools to identify hotspots and optimize placement of critical components within the design to mitigate thermal issues in 5SGXEA5N3F45C2L.

4. Design Partitioning:

Partition the design into smaller, manageable blocks to facilitate parallel development and optimize resource utilization in 5SGXEA5N3F45C2L. Utilize hierarchical design techniques and IP (Intellectual Property) cores to efficiently manage complexity and promote reusability across projects.

5. Clock Management:

Implement clock domain crossing techniques, such as synchronous FIFOs (First-In-First-Out buffers) and dual-clock FIFOs, to manage asynchronous clock domains effectively. Utilize PLLs (Phase-Locked Loops) and clock networks within 5SGXEA5N3F45C2L to generate and distribute clock signals with minimal jitter and skew.

Considerations:

When optimizing the design, consider factors such as:

- Resource Utilization: Optimize logic utilization and resource sharing to maximize performance and minimize device cost in 5SGXEA5N3F45C2L.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met, considering factors like clock frequency, routing delay, and setup/hold times.

- Design Constraints: Define and enforce design constraints to guide the synthesis, place-and-route, and timing closure processes, ensuring the design meets performance, power, and size targets.

- Design Validation: Employ comprehensive validation techniques, including simulation, emulation, and hardware testing, to verify the functionality, performance, and reliability of the design on 5SGXEA5N3F45C2L.

5SGXEA5N3F45C2L FAQ

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6. What is the process for return or replacement of 5SGXEA5N3F45C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA5N3F45C2L we delivered, we will accept the replacement or return of the 5SGXEA5N3F45C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA5N3F45C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations