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Name: 5SGXEA5K1F35I2N
Brand: Intel
SKU: 5SGXEA5K1F35I2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA5K1F35I2N

Part No.:: 5SGXEA5K1F35I2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA5K1F35I2N.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3393

Quantity:: Add To Cart

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5SGXEA5K1F35I2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA5K1F35I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA5K1F35I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA5K1F35I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA5K1F35I2N information

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5SGXEA5K1F35I2N Application Introduction

5SGXEA5K1F35I2N is a high-performance FPGA chip designed by Intel, offering extensive resources and flexibility for complex digital designs.

Application Scenario:

In a telecommunications project, 5SGXEA5K1F35I2N can be utilized to implement advanced signal processing algorithms for tasks such as channel equalization and modulation/demodulation.

Circuit Design:

To effectively utilize 5SGXEA5K1F35I2N in a digital design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and prolong the battery life of portable devices utilizing 5SGXEA5K1F35I2N. Utilize power gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) to minimize power consumption during idle and low-load periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and noise, ensuring reliable data transmission and reception. Utilize impedance matching techniques, controlled impedance routing, and proper ground and power plane design to maintain signal integrity across high-speed interfaces connected to 5SGXEA5K1F35I2N.

3. Thermal Management:

Prevent overheating of 5SGXEA5K1F35I2N by implementing effective thermal management strategies. Utilize heat sinks, thermal vias, and fans to dissipate heat generated during operation. Ensure proper airflow within the system enclosure and monitor the temperature using built-in thermal sensors to prevent thermal throttling and maintain reliable operation.

4. Resource Utilization:

Optimize the utilization of FPGA resources, such as logic elements (LEs), memory blocks, and DSP slices, to maximize the efficiency of the design and minimize resource wastage. Utilize synthesis and optimization tools provided by the FPGA vendor to analyze and optimize the design for resource utilization, timing constraints, and power consumption.

5. Clock Management:

Implement robust clocking architectures to ensure synchronous operation and minimize clock skew within the FPGA design. Utilize dedicated clock networks, PLLs, and clock distribution networks to generate and distribute clock signals efficiently. Perform static timing analysis (STA) to verify timing constraints and optimize clocking parameters for reliable operation.

Considerations:

When designing with 5SGXEA5K1F35I2N, it's essential to consider:

- Design Constraints: Ensure compliance with design constraints such as timing, power, and resource utilization specified by the FPGA datasheet and vendor guidelines.

- Design Verification: Thoroughly verify the functionality and performance of the FPGA design through simulation, emulation, and hardware testing to detect and address any design flaws or errors.

- Security: Implement security features such as bitstream encryption, authentication, and secure boot to protect the FPGA design from unauthorized access, tampering, and intellectual property theft.

- Design Reusability: Modularize the FPGA design to facilitate reusability and scalability across multiple projects or applications, promoting faster development cycles and reducing time-to-market.

- Documentation: Maintain comprehensive documentation detailing the design specifications, implementation details, and testing procedures to facilitate collaboration, troubleshooting, and future maintenance of the FPGA-based system.

5SGXEA5K1F35I2N FAQ

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3. Are the 5SGXEA5K1F35I2N price and inventory displayed accurate?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEA5K1F35I2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA5K1F35I2N we delivered, we will accept the replacement or return of the 5SGXEA5K1F35I2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA5K1F35I2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations