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Name: 5SGXEA5H3F35C2N
Brand: Intel
SKU: 5SGXEA5H3F35C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA5H3F35C2N

Part No.:: 5SGXEA5H3F35C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA5H3F35C2N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2702

Quantity:: Add To Cart

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5SGXEA5H3F35C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA5H3F35C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA5H3F35C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA5H3F35C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA5H3F35C2N information

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5SGXEA5H3F35C2N Application Introduction

5SGXEA5H3F35C2N is a high-performance FPGA (Field Programmable Gate Array) device, commonly used in various electronic design projects for its versatility and computational power.

Application Scenario:

In digital signal processing applications, 5SGXEA5H3F35C2N can be utilized to implement complex algorithms for image processing, audio processing, and communication systems.

Design Optimization:

To effectively utilize 5SGXEA5H3F35C2N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation of 5SGXEA5H3F35C2N. Utilize power gating, dynamic voltage and frequency scaling, and sleep modes to optimize power usage during idle and low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as crosstalk, reflections, and signal distortion. Use proper routing techniques, impedance matching, and ground/power plane separation to maintain signal integrity and ensure reliable communication within the FPGA and with external devices.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain optimal operating temperature for 5SGXEA5H3F35C2N. Use heat sinks, thermal vias, and fans to dissipate heat efficiently, and consider ambient temperature, airflow, and enclosure design to prevent thermal issues.

4. Clock Distribution:

Optimize clock distribution within the FPGA to minimize clock skew, jitter, and timing violations. Use clock networks efficiently, implement clock domain crossing techniques, and ensure proper synchronization between different clock domains to maintain timing integrity and maximize system performance.

5. Resource Utilization:

Maximize resource utilization within 5SGXEA5H3F35C2N by optimizing logic synthesis, mapping, and placement algorithms. Utilize FPGA-specific features such as DSP blocks, embedded memory, and high-speed transceivers effectively to achieve the desired functionality while minimizing resource usage and meeting performance requirements.

Considerations:

When optimizing the design, consider:

- Design Constraints: Understand the performance, power, and area constraints of 5SGXEA5H3F35C2N and optimize the design accordingly to meet these requirements.

- Design Validation: Perform thorough testing and simulation to validate the design and ensure functionality, performance, and reliability under various operating conditions.

- Design Iteration: Iterate the design process to refine and improve the design based on feedback from testing, simulation, and performance analysis.

- Design Documentation: Maintain comprehensive documentation of the design, including schematics, PCB layouts, design constraints, and optimization techniques, to facilitate future maintenance, debugging, and scalability.

5SGXEA5H3F35C2N FAQ

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3. Are the 5SGXEA5H3F35C2N price and inventory displayed accurate?

The price and inventory of 5SGXEA5H3F35C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA5H3F35C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA5H3F35C2N we delivered, we will accept the replacement or return of the 5SGXEA5H3F35C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA5H3F35C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations