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Name: 5SGXEA5H2F35I2LN
Brand: Intel
SKU: 5SGXEA5H2F35I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA5H2F35I2LN

Part No.:: 5SGXEA5H2F35I2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA5H2F35I2LN.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2130

Quantity:: Add To Cart

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5SGXEA5H2F35I2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA5H2F35I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA5H2F35I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA5H2F35I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA5H2F35I2LN information

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5SGXEA5H2F35I2LN Application Introduction

5SGXEA5H2F35I2LN is a high-density and high-performance FPGA device manufactured by Intel, offering a wide range of capabilities for complex digital designs.

Application Scenario:

In the field of telecommunications, 5SGXEA5H2F35I2LN can be utilized to implement advanced signal processing algorithms for baseband processing in wireless communication systems.

Design Optimization:

To effectively utilize 5SGXEA5H2F35I2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 5SGXEA5H2F35I2LN. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to adapt power supply levels based on workload demands.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal distortions. Employ techniques such as controlled impedance routing, signal length matching, and proper grounding to mitigate signal integrity issues and optimize performance.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure long-term reliability of 5SGXEA5H2F35I2LN. Incorporate heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat generated during operation.

4. Resource Utilization:

Optimize resource utilization by carefully mapping and placing logic elements, memory blocks, and I/O interfaces within the FPGA fabric. Utilize advanced synthesis and optimization tools provided by the FPGA vendor to achieve maximum performance and efficiency.

5. Clock Management:

Implement robust clocking architectures to ensure synchronous operation and minimize clock skew issues. Use dedicated clock networks, PLLs, and clock tree synthesis techniques to generate and distribute clock signals with minimal jitter and skew.

Considerations:

When designing with 5SGXEA5H2F35I2LN, it's crucial to consider:

- Design Constraints: Understand and adhere to the design constraints specified by the FPGA device datasheet, including maximum operating frequencies, timing requirements, and resource utilization limits.

- Design Partitioning: Partition the design into smaller functional blocks to facilitate easier design implementation and debugging. Use hierarchical design methodologies to manage complexity and optimize performance.

- Verification and Testing: Thoroughly verify the design through simulation, emulation, and hardware testing to ensure functional correctness and meet design specifications. Implement built-in self-test (BIST) features for comprehensive testing and diagnosis.

- Design Security: Implement security measures such as encryption, authentication, and secure booting to protect intellectual property and prevent unauthorized access or tampering of the FPGA design.

- Documentation and Collaboration: Maintain detailed documentation throughout the design process to facilitate collaboration among team members and ensure seamless project management. Document design decisions, constraints, and implementation details for future reference and troubleshooting.

5SGXEA5H2F35I2LN FAQ

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3. Are the 5SGXEA5H2F35I2LN price and inventory displayed accurate?

The price and inventory of 5SGXEA5H2F35I2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA5H2F35I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA5H2F35I2LN we delivered, we will accept the replacement or return of the 5SGXEA5H2F35I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA5H2F35I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations