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Name: 5SGXEA5H2F35C3N
Brand: Intel
SKU: 5SGXEA5H2F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA5H2F35C3N

Part No.:: 5SGXEA5H2F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA5H2F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3432

Quantity:: Add To Cart

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5SGXEA5H2F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA5H2F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA5H2F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA5H2F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA5H2F35C3N information

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5SGXEA5H2F35C3N Application Introduction

5SGXEA5H2F35C3N is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced capabilities for various digital design projects.

Application Overview:

In digital signal processing applications, 5SGXEA5H2F35C3N can be utilized to implement complex algorithms for tasks such as image processing, audio processing, and telecommunications.

Design Guidelines:

To effectively utilize 5SGXEA5H2F35C3N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption in the FPGA design. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to minimize power wastage and extend battery life in portable applications.

2. Signal Integrity:

Pay attention to signal integrity issues to ensure reliable data transmission within the FPGA and between external devices. Proper PCB layout techniques, such as impedance matching and signal termination, can help mitigate signal integrity challenges and reduce noise interference.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of 5SGXEA5H2F35C3N. Utilize heat sinks, fans, or liquid cooling solutions to dissipate heat generated during FPGA operation, especially in high-performance applications with intensive computational tasks.

4. Design Partitioning:

Break down the FPGA design into smaller, manageable modules to facilitate easier debugging, verification, and optimization. Utilize hierarchical design techniques and IP core integration to streamline the design process and improve overall productivity.

5. Timing Closure:

Ensure timing closure by carefully analyzing and optimizing the timing constraints of the FPGA design. Utilize advanced synthesis and place-and-route tools to meet timing requirements and achieve maximum performance without violating critical paths.

Considerations:

When designing with 5SGXEA5H2F35C3N, consider the following factors:

- Resource Utilization: Optimize resource utilization to minimize area overhead and maximize the efficiency of the FPGA design.

- Design Iterations: Plan for multiple design iterations to refine and optimize the FPGA implementation based on performance, power, and area constraints.

- Design Validation: Thoroughly validate the FPGA design using simulation, emulation, and prototyping techniques to ensure functionality, performance, and reliability before deployment.

- Documentation: Maintain comprehensive documentation throughout the design process to facilitate collaboration, troubleshooting, and future revisions.

- Continuous Improvement: Continuously evaluate and incorporate new design methodologies, tools, and technologies to enhance the efficiency and performance of FPGA-based designs.

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3. Are the 5SGXEA5H2F35C3N price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXEA5H2F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA5H2F35C3N we delivered, we will accept the replacement or return of the 5SGXEA5H2F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA5H2F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations