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Name: 5SGXEA4K3F40C2L
Brand: Intel
SKU: 5SGXEA4K3F40C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA4K3F40C2L

Part No.:: 5SGXEA4K3F40C2L

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 5SGXEA4K3F40C2L.pdf

Description:: IC FPGA 696 I/O 1517FBGA

In Stock:: 3439

Quantity:: Add To Cart

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5SGXEA4K3F40C2L Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
696
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA4K3F40C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA4K3F40C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA4K3F40C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA4K3F40C2L information

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5SGXEA4K3F40C2L Application Introduction

5SGXEA4K3F40C2L is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel (formerly Altera), offering advanced features and capabilities for complex digital design projects.

Application Overview:

In various applications such as telecommunications, aerospace, and industrial automation, 5SGXEA4K3F40C2L can be utilized for tasks such as signal processing, data encryption, and control system implementation.

Design Optimization Techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption in 5SGXEA4K3F40C2L-based designs. Utilize power gating techniques to selectively power down unused modules or regions of the FPGA when not in operation, reducing overall power consumption and extending battery life in portable applications.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing PCB layouts and utilizing signal termination techniques. Pay attention to high-speed signal routing and minimize signal reflections and crosstalk by adhering to signal integrity best practices. Utilize the advanced I/O capabilities of 5SGXEA4K3F40C2L to implement differential signaling and impedance matching for improved signal quality.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure reliable operation of 5SGXEA4K3F40C2L-based systems. Utilize thermal vias and heat sinks to dissipate heat generated during FPGA operation. Optimize FPGA placement and airflow within the system enclosure to maintain acceptable operating temperatures and prevent thermal throttling.

4. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier implementation and verification. Utilize hierarchical design methodologies to organize the FPGA logic into logical blocks with well-defined interfaces, enabling easier debugging and maintenance of the design.

5. Timing Closure:

Pay close attention to timing constraints and perform thorough timing analysis to ensure timing closure in 5SGXEA4K3F40C2L-based designs. Utilize advanced synthesis and optimization techniques to minimize critical path delays and meet timing requirements. Implement clock domain crossing (CDC) techniques to synchronize signals between different clock domains and prevent metastability issues.

Considerations:

- Resource Utilization: Optimize resource utilization in 5SGXEA4K3F40C2L by carefully managing logic, memory, and DSP blocks to maximize design efficiency and minimize resource wastage.

- Design Security: Implement security features such as bitstream encryption and authentication to protect sensitive design IP and prevent unauthorized access or tampering with the FPGA configuration.

- Design for Testability: Incorporate built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of 5SGXEA4K3F40C2L-based designs during development and deployment.

- Environmental Considerations: Consider environmental factors such as temperature, humidity, and vibration when designing 5SGXEA4K3F40C2L-based systems for reliable operation in harsh operating conditions.

5SGXEA4K3F40C2L FAQ

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3. Are the 5SGXEA4K3F40C2L price and inventory displayed accurate?

The price and inventory of 5SGXEA4K3F40C2L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA4K3F40C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA4K3F40C2L we delivered, we will accept the replacement or return of the 5SGXEA4K3F40C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA4K3F40C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations