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Name: 5SGXEA4K3F35C2N
Brand: Intel
SKU: 5SGXEA4K3F35C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEA4K3F35C2N

Part No.:: 5SGXEA4K3F35C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA4K3F35C2N.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3757

Quantity:: Add To Cart

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5SGXEA4K3F35C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA4K3F35C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA4K3F35C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA4K3F35C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA4K3F35C2N information

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5SGXEA4K3F35C2N Application Introduction

5SGXEA4K3F35C2N is a high-performance FPGA chip manufactured by Intel, offering extensive capabilities for various digital design projects. It features a large number of logic elements, high-speed transceivers, and dedicated DSP blocks, making it suitable for demanding applications.

Application Scope:

In digital signal processing (DSP) applications, 5SGXEA4K3F35C2N can be utilized for tasks such as real-time image processing, audio processing, and communications signal modulation/demodulation.

Design Optimization:

To effectively utilize 5SGXEA4K3F35C2N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power consumption. Utilize power gating and dynamic voltage and frequency scaling (DVFS) mechanisms to adapt power consumption based on the operational requirements of the FPGA.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues. Use impedance-controlled routing for high-speed interfaces and differential signaling to reduce electromagnetic interference (EMI). Pay attention to signal termination and decoupling capacitors placement for noise reduction.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating of the 5SGXEA4K3F35C2N FPGA. Utilize heat sinks, thermal vias, and proper airflow within the system enclosure to maintain the operating temperature within the specified limits.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter. Use clock tree synthesis (CTS) techniques to balance clock paths and reduce setup and hold time violations. Implement clock domain crossing (CDC) synchronization for reliable data transfer between different clock domains.

5. Resource Utilization:

Maximize resource utilization by efficiently mapping the design onto the 5SGXEA4K3F35C2N FPGA. Utilize the available logic elements, memory blocks, and DSP slices effectively to achieve the desired functionality while minimizing resource wastage.

Considerations:

When designing with 5SGXEA4K3F35C2N, it's essential to consider:

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met across the design.

- Design Security: Implement appropriate security measures, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Validation: Conduct extensive functional and performance testing to verify the correctness and reliability of the design under various operating conditions.

- Design Scalability: Design the system with scalability in mind to accommodate future enhancements or changes in the project requirements without significant redesign efforts.

- Documentation: Maintain comprehensive documentation covering the design specifications, implementation details, and testing procedures to facilitate troubleshooting and future maintenance.

5SGXEA4K3F35C2N FAQ

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3. Are the 5SGXEA4K3F35C2N price and inventory displayed accurate?

The price and inventory of 5SGXEA4K3F35C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA4K3F35C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA4K3F35C2N we delivered, we will accept the replacement or return of the 5SGXEA4K3F35C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA4K3F35C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations