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Name: 5SGXEA4K3F35C2L
Brand: Intel
SKU: 5SGXEA4K3F35C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA4K3F35C2L

Part No.:: 5SGXEA4K3F35C2L

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA4K3F35C2L.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 2382

Quantity:: Add To Cart

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5SGXEA4K3F35C2L Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEA4K3F35C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA4K3F35C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA4K3F35C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA4K3F35C2L information

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5SGXEA4K3F35C2L Application Introduction

5SGXEA4K3F35C2L is a high-performance FPGA (Field-Programmable Gate Array) device, widely utilized in various electronic design projects for its versatility and capability to handle complex logic functions.

Application Scenario:

In digital signal processing applications, 5SGXEA4K3F35C2L can be employed to implement real-time algorithms for audio and video processing, such as in multimedia systems or communication devices.

Design Optimization Techniques:

To effectively utilize 5SGXEA4K3F35C2L in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 5SGXEA4K3F35C2L. Utilize low-power design techniques, such as clock gating and power gating, to reduce dynamic and static power consumption.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing the PCB layout and routing high-speed signals away from noise sources. Use impedance matching techniques and termination resistors to minimize signal reflections and ensure reliable communication within the FPGA and with external components.

3. Thermal Management:

Manage thermal issues effectively by incorporating heat sinks, thermal vias, and proper airflow within the system. Ensure adequate spacing between components to facilitate heat dissipation and prevent thermal hotspots, which can affect the performance and reliability of 5SGXEA4K3F35C2L.

4. Clock Management:

Optimize clock distribution within the FPGA by using dedicated clock networks and implementing clock domain crossing techniques to minimize clock skew and ensure synchronous operation of different modules. Utilize PLLs (Phase-Locked Loops) and DLLs (Delay-Locked Loops) for clock synthesis and alignment to meet timing requirements.

5. Design Partitioning:

Break down the design into smaller, manageable modules and leverage hierarchical design techniques to facilitate easier debugging, testing, and maintenance. Utilize the resources of 5SGXEA4K3F35C2L efficiently by optimizing resource utilization and minimizing routing congestion.

Considerations:

When designing with 5SGXEA4K3F35C2L, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize performance and minimize cost.

- Timing Closure: Ensure timing closure by analyzing and optimizing the critical paths within the design to meet the required performance specifications.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Validation: Thoroughly validate the design through simulations, emulation, and prototyping to ensure functionality, performance, and reliability before deployment.

5SGXEA4K3F35C2L FAQ

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6. What is the process for return or replacement of 5SGXEA4K3F35C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA4K3F35C2L we delivered, we will accept the replacement or return of the 5SGXEA4K3F35C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA4K3F35C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations