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Name: 5SGXEA3K3F35I3N
Brand: Intel
SKU: 5SGXEA3K3F35I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA3K3F35I3N

Part No.:: 5SGXEA3K3F35I3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA3K3F35I3N.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3275

Quantity:: Add To Cart

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5SGXEA3K3F35I3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA3K3F35I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA3K3F35I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA3K3F35I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA3K3F35I3N information

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The application and technological advancement of 5SGXEA3K3F35I3N in specific industries

5SGXEA3K3F35I3N is a high-performance FPGA chip developed by Intel, offering advanced capabilities for a wide range of applications in different industries.

Application Scenario:

In the aerospace industry, 5SGXEA3K3F35I3N can be utilized to enhance the performance of onboard systems in satellites and spacecraft, enabling tasks such as image processing, data compression, and communication protocol handling with high efficiency and reliability.

Circuit Design:

To design a satellite onboard system using 5SGXEA3K3F35I3N, follow these steps:

1. Image Processing:

Implement image processing algorithms using the programmable logic resources of 5SGXEA3K3F35I3N to analyze and enhance images captured by onboard cameras. Utilize high-speed I/O interfaces to interface with camera modules and memory devices.

2. Data Compression:

Utilize the parallel processing capabilities of 5SGXEA3K3F35I3N to perform real-time data compression on telemetry and sensor data, reducing the amount of data transmitted to ground stations. Implement efficient compression algorithms to minimize bandwidth usage.

3. Communication:

Integrate communication protocols, such as Ethernet or SpaceWire, using the configurable I/O resources of 5SGXEA3K3F35I3N to facilitate data exchange with ground stations and other spacecraft systems. Implement error correction and fault tolerance mechanisms for reliable communication.

4. Onboard Control:

Utilize the FPGA's reconfigurable logic to implement control algorithms for various onboard subsystems, such as attitude control systems and power management units. Ensure real-time responsiveness and fault detection capabilities for autonomous operation.

5. Radiation Hardening:

Implement radiation-hardening techniques, such as triple modular redundancy (TMR) and error correction codes (ECC), to mitigate the effects of cosmic radiation on the 5SGXEA3K3F35I3N FPGA. Design redundant systems to ensure mission-critical functionality in harsh space environments.

Considerations:

When designing the onboard system, it's essential to consider:

- Power Efficiency: Optimize the FPGA design to minimize power consumption and extend the operating life of the satellite's power supply.

- Thermal Management: Implement thermal management strategies to dissipate heat generated by the 5SGXEA3K3F35I3N FPGA and other onboard electronics, ensuring reliable operation over the satellite's mission duration.

- Reliability Testing: Conduct extensive testing and simulation to verify the functionality and reliability of the onboard system under simulated space conditions, including temperature extremes, vacuum environments, and radiation exposure.

- System Integration: Ensure seamless integration of the FPGA-based onboard system with other spacecraft subsystems, including sensors, actuators, and communication interfaces, to achieve mission objectives effectively.

- Compliance with Standards: Adhere to industry standards and regulations, such as NASA's space flight standards and MIL-STD-1540E, to ensure the quality, safety, and reliability of the satellite's onboard systems.

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6. What is the process for return or replacement of 5SGXEA3K3F35I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA3K3F35I3N we delivered, we will accept the replacement or return of the 5SGXEA3K3F35I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA3K3F35I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations