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Name: 5SGXEA3H1F35I2N
Brand: Intel
SKU: 5SGXEA3H1F35I2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA3H1F35I2N

Part No.:: 5SGXEA3H1F35I2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXEA3H1F35I2N.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3682

Quantity:: Add To Cart

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5SGXEA3H1F35I2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA3H1F35I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA3H1F35I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA3H1F35I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA3H1F35I2N information

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The application and technological advancement of 5SGXEA3H1F35I2N in specific industries

5SGXEA3H1F35I2N is a field-programmable gate array (FPGA) chip renowned for its high-performance computing capabilities and versatile applications across various industries. Featuring advanced architecture and exceptional programmability, the 5SGXEA3H1F35I2N FPGA is revolutionizing industries by enabling complex processing tasks and enhancing technological standards.

Application Scenario:

In the aerospace industry, 5SGXEA3H1F35I2N FPGA is instrumental in spacecraft design and operation. Its ability to handle massive amounts of data with low latency makes it ideal for onboard processing tasks, such as image analysis, navigation, and communication systems.

Circuit Design:

To implement 5SGXEA3H1F35I2N FPGA in a spacecraft application, the following circuit design considerations should be taken into account:

1. Data Processing:

Utilize the high-speed processing capabilities of 5SGXEA3H1F35I2N FPGA to handle data-intensive tasks like image processing and sensor data fusion. Implement custom algorithms and logic circuits tailored to specific mission requirements.

2. Communication:

Integrate 5SGXEA3H1F35I2N FPGA with onboard communication systems to facilitate real-time data transmission between the spacecraft and ground stations. Utilize high-speed serial interfaces and protocol converters for seamless communication.

3. Fault Tolerance:

Implement fault-tolerant design techniques using redundancy and error correction mechanisms within the 5SGXEA3H1F35I2N FPGA configuration. Ensure reliable operation in harsh space environments where radiation-induced errors are prevalent.

4. Power Management:

Optimize power consumption by leveraging the reconfigurable nature of 5SGXEA3H1F35I2N FPGA to dynamically adjust processing resources based on workload demands. Implement power gating and voltage scaling techniques for efficient energy utilization.

5. Testing and Verification:

Conduct extensive testing and verification of the FPGA-based system to ensure functionality and reliability under simulated space conditions. Perform radiation testing to assess the resilience of 5SGXEA3H1F35I2N FPGA against cosmic radiation effects.

Impact:

The integration of 5SGXEA3H1F35I2N FPGA in spacecraft design not only enhances processing capabilities but also improves mission efficiency and reliability. By enabling onboard data processing and communication, 5SGXEA3H1F35I2N FPGA contributes to cost reduction and mission success in the aerospace industry.

Considerations:

When deploying 5SGXEA3H1F35I2N FPGA in aerospace applications, it's essential to consider:

- Radiation Hardening: Implement mitigation strategies to safeguard the FPGA against single-event upsets (SEUs) and total ionizing dose (TID) effects induced by radiation.

- Thermal Management: Design efficient thermal dissipation mechanisms to prevent overheating of the FPGA in the vacuum of space and ensure reliable operation over extended mission durations.

- Compliance: Ensure compliance with relevant aerospace standards and regulations for hardware reliability, electromagnetic compatibility, and safety.

- Scalability: Design the FPGA-based system with scalability in mind to accommodate future mission requirements and technological advancements.

- Collaboration: Foster collaboration with industry partners and research institutions to leverage expertise in FPGA technology and space exploration for mutual benefit.

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6. What is the process for return or replacement of 5SGXEA3H1F35I2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA3H1F35I2N we delivered, we will accept the replacement or return of the 5SGXEA3H1F35I2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA3H1F35I2N.

(3)The PartNo is unused and only in the original unpacked packaging.

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