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Name: 5SGXEA3H1F35I2G
Brand: Intel
SKU: 5SGXEA3H1F35I2G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEA3H1F35I2G

Part No.:: 5SGXEA3H1F35I2G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3103

Quantity:: Add To Cart

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5SGXEA3H1F35I2G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEA3H1F35I2G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEA3H1F35I2G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEA3H1F35I2G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEA3H1F35I2G information

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5SGXEA3H1F35I2G Application Introduction

5SGXEA3H1F35I2G is a high-performance FPGA chip used in a variety of complex digital design applications. It offers advanced features such as high-speed transceivers, abundant logic resources, and robust I/O capabilities, making it ideal for demanding tasks in fields like telecommunications, data centers, and industrial automation.

Application Scenario:

In telecommunications, this chip can be used to implement high-speed data processing and signal routing, enabling efficient and reliable communication infrastructure.

Circuit Design:

To design an efficient telecommunications system using 5SGXEA3H1F35I2G, follow these steps:

1. Power Management:

Ensure stable and efficient power delivery by designing a robust power management system. Use high-efficiency voltage regulators and decoupling capacitors to provide clean power to the chip. Consider implementing power sequencing to ensure the FPGA and its peripherals power up in a controlled manner.

2. Signal Integrity:

Maintain high signal integrity by carefully designing the PCB layout. Minimize the length of high-speed signal traces and avoid sharp bends. Implement proper impedance matching for all high-speed data lines. Use differential signaling for critical data paths to reduce noise and crosstalk.

3. Thermal Management:

Proper thermal management is crucial for the reliable operation of 5SGXEA3H1F35I2G. Use heatsinks, thermal pads, and active cooling solutions like fans to dissipate heat effectively. Place thermal vias under the FPGA to enhance heat conduction away from the chip.

4. I/O Configuration:

Configure the I/O pins according to the specific requirements of your application. For high-speed data interfaces, ensure that the I/O standards and drive strengths are correctly set. Use external termination resistors if necessary to maintain signal integrity.

5. Clock Management:

Implement a reliable clock management system. Use high-quality crystal oscillators or clock generators to provide stable clock signals. Use PLLs and clock buffers to distribute clock signals with minimal skew and jitter.

Considerations:

When designing the circuit, it's essential to consider:

- PCB Layout: Optimize the PCB layout for signal integrity, power distribution, and thermal management.

- Power Budgeting: Ensure that the power supply can handle the peak current demands of 5SGXEA3H1F35I2G and its peripherals.

- Testing and Validation: Perform thorough testing and validation of the design to ensure it meets performance and reliability requirements.

- Compliance: Ensure the design complies with relevant industry standards and regulations for electromagnetic compatibility (EMC) and safety.

5SGXEA3H1F35I2G FAQ

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3. Are the 5SGXEA3H1F35I2G price and inventory displayed accurate?

The price and inventory of 5SGXEA3H1F35I2G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEA3H1F35I2G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEA3H1F35I2G we delivered, we will accept the replacement or return of the 5SGXEA3H1F35I2G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEA3H1F35I2G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations