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Name: 5SGTMC5K3F40I2
Brand: Intel
SKU: 5SGTMC5K3F40I2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGTMC5K3F40I2

Part No.:: 5SGTMC5K3F40I2

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 5SGTMC5K3F40I2.pdf

Description:: IC FPGA 600 I/O 1517FBGA

In Stock:: 3376

Quantity:: Add To Cart

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5SGTMC5K3F40I2 Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GT
ProductStatus:
Obsolete
NumberofLABs/CLBs:
160500
NumberofLogicElements/Cells:
425000
TotalRAMBits:
46080000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGTMC5K3F40I2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGTMC5K3F40I2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGTMC5K3F40I2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGTMC5K3F40I2 information

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5SGTMC5K3F40I2 Application Introduction

5SGTMC5K3F40I2 is a high-performance FPGA device widely used in advanced digital design projects, offering flexible programmability and excellent resource utilization.

Application Scenario:

In digital signal processing applications, 5SGTMC5K3F40I2 can be utilized to implement complex algorithms for tasks such as image processing or wireless communication.

Circuit Design:

To effectively utilize 5SGTMC5K3F40I2 in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of 5SGTMC5K3F40I2 and associated components. Utilize power gating, dynamic voltage and frequency scaling, and low-power standby modes to achieve energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure robust signal integrity. Use controlled impedance traces, proper termination techniques, and adequate ground and power plane design to mitigate signal reflections, crosstalk, and electromagnetic interference.

3. Thermal Management:

Deploy effective thermal management strategies to dissipate heat generated by 5SGTMC5K3F40I2 during operation. Utilize heat sinks, thermal vias, and proper airflow design to prevent overheating and ensure reliable long-term performance.

4. Resource Utilization:

Optimize resource utilization by efficiently mapping design elements to FPGA resources, such as logic cells, memory blocks, and DSP slices. Utilize advanced synthesis and optimization techniques, such as pipelining, parallelization, and resource sharing, to maximize performance and minimize resource usage.

5. Design Validation:

Thoroughly validate the design through simulation, emulation, and prototyping to ensure functional correctness, timing closure, and performance optimization. Use FPGA-specific validation tools and methodologies to identify and resolve design issues early in the development cycle.

Considerations:

When designing with 5SGTMC5K3F40I2, consider the following factors to achieve optimal results:

- Design Partitioning: Divide the design into manageable modules for easier development, debugging, and maintenance.

- Clock Domain Crossing: Properly synchronize signals crossing between different clock domains to prevent metastability and ensure reliable operation.

- Timing Closure: Pay close attention to timing constraints and optimize the design to meet timing requirements for reliable operation at the desired clock frequency.

- Design Security: Implement security features, such as encryption and authentication, to protect the intellectual property and ensure the integrity of the design.

- Design for Testability: Incorporate built-in self-test (BIST) and debug features to facilitate testing and troubleshooting during development and production.

5SGTMC5K3F40I2 FAQ

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3. Are the 5SGTMC5K3F40I2 price and inventory displayed accurate?

The price and inventory of 5SGTMC5K3F40I2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGTMC5K3F40I2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGTMC5K3F40I2 we delivered, we will accept the replacement or return of the 5SGTMC5K3F40I2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGTMC5K3F40I2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations