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Name: 5SGSMD8N2F45C2L
Brand: Intel
SKU: 5SGSMD8N2F45C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD8N2F45C2L

Part No.:: 5SGSMD8N2F45C2L

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGSMD8N2F45C2L.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3934

Quantity:: Add To Cart

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5SGSMD8N2F45C2L Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
262400
NumberofLogicElements/Cells:
695000
TotalRAMBits:
51200000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGSMD8N2F45C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD8N2F45C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD8N2F45C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD8N2F45C2L information

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5SGSMD8N2F45C2L Application Introduction

5SGSMD8N2F45C2L is a high-density and high-performance FPGA device manufactured by Intel, suitable for a wide range of applications in industries such as telecommunications, automotive, and aerospace.

Application Scenario:

In telecommunications, 5SGSMD8N2F45C2L can be utilized in base station equipment for signal processing and data transmission, enabling high-speed and reliable communication networks.

Circuit Design:

To effectively utilize 5SGSMD8N2F45C2L in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal performance and minimize power consumption of 5SGSMD8N2F45C2L and associated components. Utilize power gating, voltage scaling, and dynamic power management strategies to achieve energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches, ensuring robust signal integrity throughout the system. Utilize proper termination techniques, controlled impedance traces, and signal integrity analysis tools to validate the design.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation of 5SGSMD8N2F45C2L. Incorporate heat sinks, thermal vias, and airflow optimization in the PCB design to dissipate heat efficiently. Monitor the temperature of the device and implement thermal protection mechanisms if necessary.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring synchronous operation of 5SGSMD8N2F45C2L and synchronized data processing. Utilize low-skew clock distribution techniques, such as clock tree synthesis and clock buffering, to achieve reliable timing performance.

5. Configuration Management:

Implement robust configuration management techniques to ensure secure and reliable programming of 5SGSMD8N2F45C2L and firmware updates. Utilize secure boot mechanisms, encryption algorithms, and integrity verification protocols to protect the configuration data and prevent unauthorized access or tampering.

Considerations:

When designing with 5SGSMD8N2F45C2L, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize performance and minimize resource conflicts.

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing constraints and achieves maximum operating frequency. Utilize advanced synthesis and place-and-route tools to address timing violations and optimize critical paths.

- Design Validation: Conduct thorough functional verification and simulation testing to validate the functionality and performance of the design under various operating conditions and corner cases.

- Design Security: Implement security features, such as device authentication, access control, and encryption, to protect the intellectual property and sensitive data stored in 5SGSMD8N2F45C2L from unauthorized access or tampering.

- Design for Manufacturability: Consider manufacturing constraints and testability requirements during the design phase to facilitate smooth production and testing processes. Collaborate with manufacturing partners to optimize the design for manufacturability and ensure high yield and reliability.

5SGSMD8N2F45C2L FAQ

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3. Are the 5SGSMD8N2F45C2L price and inventory displayed accurate?

The price and inventory of 5SGSMD8N2F45C2L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSMD8N2F45C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD8N2F45C2L we delivered, we will accept the replacement or return of the 5SGSMD8N2F45C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD8N2F45C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations