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Name: 5SGSMD6N2F45I2LG
Brand: Intel
SKU: 5SGSMD6N2F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD6N2F45I2LG

Part No.:: 5SGSMD6N2F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2141

Quantity:: Add To Cart

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5SGSMD6N2F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Active
NumberofLABs/CLBs:
220000
NumberofLogicElements/Cells:
583000
TotalRAMBits:
46080000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGSMD6N2F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD6N2F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD6N2F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD6N2F45I2LG information

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5SGSMD6N2F45I2LG Application Introduction

5SGSMD6N2F45I2LG is an advanced FPGA chip that offers high performance and versatility for a wide range of applications, including telecommunications, data centers, and industrial automation.

Application Scenario:

In telecommunications, this chip can be used to process high-speed data, manage network protocols, and optimize signal integrity in communication systems.

Design Optimization:

To effectively use 5SGSMD6N2F45I2LG in your design projects, consider the following optimization tips:

Power Management:

Efficient power management is crucial for maintaining the performance and longevity of your FPGA-based system. Implementing the following strategies can help optimize power usage:

1. Voltage Regulation:

Use high-efficiency voltage regulators to supply stable power to 5SGSMD6N2F45I2LG. Ensure the voltage levels are within the recommended range to prevent damage and ensure optimal performance.

2. Power Sequencing:

Proper power sequencing is essential to avoid damage during power-up and power-down cycles. Follow the power sequencing guidelines provided in the datasheet to ensure the chip initializes correctly.

3. Dynamic Power Management:

Implement dynamic power management techniques, such as clock gating and power gating, to reduce power consumption during periods of low activity. This approach helps in saving energy and reducing heat generation.

Signal Integrity:

Maintaining signal integrity is vital for high-speed data processing and communication. Consider the following tips to enhance signal quality:

1. PCB Layout:

Design a PCB layout that minimizes noise and signal interference. Use proper grounding techniques, and keep high-speed signal traces short and direct. Use controlled impedance traces for high-frequency signals.

2. Decoupling Capacitors:

Place decoupling capacitors close to the power pins of 5SGSMD6N2F45I2LG to filter out noise and provide a stable power supply. Use a combination of bulk and high-frequency capacitors for effective noise suppression.

3. Signal Termination:

Implement proper signal termination techniques, such as series or parallel termination, to match the impedance of the transmission lines and minimize signal reflections.

Thermal Management:

Effective thermal management ensures the reliable operation of your FPGA chip. Consider the following strategies to manage heat:

1. Heat Sinks:

Attach a suitable heat sink to 5SGSMD6N2F45I2LG to dissipate heat generated during operation. Choose a heat sink with adequate thermal resistance to keep the chip within safe temperature limits.

2. Airflow:

Ensure proper airflow around the FPGA chip by designing the enclosure with adequate ventilation. Use fans or other cooling mechanisms to enhance heat dissipation, especially in high-performance applications.

3. Thermal Interface Materials:

Use thermal interface materials, such as thermal pads or paste, between the FPGA chip and the heat sink to improve thermal conductivity and ensure efficient heat transfer.

Considerations:

When designing your system, consider the following factors:

- Power Supply Stability: Ensure a stable and noise-free power supply to prevent performance issues and potential damage.

- Signal Quality: Use proper signal integrity techniques to maintain high data transfer rates and minimize errors.

- Thermal Performance: Implement effective thermal management solutions to keep the FPGA chip within safe operating temperatures.

- System Reliability: Thoroughly test your design under various conditions to ensure robustness and reliability.

5SGSMD6N2F45I2LG FAQ

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3. Are the 5SGSMD6N2F45I2LG price and inventory displayed accurate?

The price and inventory of 5SGSMD6N2F45I2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSMD6N2F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD6N2F45I2LG we delivered, we will accept the replacement or return of the 5SGSMD6N2F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD6N2F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations