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Name: 5SGSMD5H2F35I3LN
Brand: Intel
SKU: 5SGSMD5H2F35I3LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD5H2F35I3LN

Part No.:: 5SGSMD5H2F35I3LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGSMD5H2F35I3LN.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2343

Quantity:: Add To Cart

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5SGSMD5H2F35I3LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
172600
NumberofLogicElements/Cells:
457000
TotalRAMBits:
39936000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGSMD5H2F35I3LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD5H2F35I3LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD5H2F35I3LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD5H2F35I3LN information

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The application and technological advancement of 5SGSMD5H2F35I3LN in specific industries

5SGSMD5H2F35I3LN is a field-programmable gate array (FPGA) chip renowned for its high performance and versatility, finding extensive applications across various industries. It boasts advanced features such as high-speed transceivers, embedded memory blocks, and customizable logic resources.

Application Scenario:

In telecommunications, 5SGSMD5H2F35I3LN plays a pivotal role in the development of next-generation network infrastructure, particularly in the deployment of 5G technology. Its unparalleled processing capabilities and flexibility make it an ideal choice for implementing complex signal processing algorithms and protocol stacks required for ultra-fast and reliable wireless communications.

Circuit Design:

To harness the power of 5SGSMD5H2F35I3LN in a telecommunications application, the following steps are typically involved:

1. Protocol Implementation:

Utilize the programmable logic resources of 5SGSMD5H2F35I3LN to implement communication protocols such as LTE, Wi-Fi, and Ethernet. This involves designing custom hardware accelerators and state machines to handle protocol-specific tasks efficiently.

2. Signal Processing:

Implement advanced signal processing algorithms, including beamforming, channel equalization, and error correction, to enhance the performance and reliability of wireless communication systems. Leverage the high-speed transceivers of 5SGSMD5H2F35I3LN for seamless data transmission and reception.

3. System Integration:

Integrate 5SGSMD5H2F35I3LN into the overall system architecture, ensuring compatibility with other components such as microprocessors, memory modules, and interface controllers. Design interface circuits and protocols to facilitate communication between the FPGA and peripheral devices.

4. Real-Time Performance:

Optimize the firmware and hardware design to meet stringent real-time performance requirements imposed by 5G networks. Employ techniques such as pipelining, parallel processing, and resource sharing to maximize throughput and minimize latency.

5. Power Management:

Implement efficient power management schemes to minimize energy consumption and heat dissipation in 5SGSMD5H2F35I3LN-based systems. Utilize dynamic voltage and frequency scaling (DVFS) techniques to adjust the operating parameters dynamically based on the workload and environmental conditions.

Considerations:

When designing with 5SGSMD5H2F35I3LN, it's essential to consider the following factors:

- Resource Utilization: Optimize the utilization of FPGA resources to achieve maximum performance and cost-effectiveness.

- Design Validation: Thoroughly validate the FPGA design through simulation, emulation, and prototyping to ensure correctness and reliability before deployment.

- Security: Implement robust security mechanisms to protect sensitive data and prevent unauthorized access or tampering with 5SGSMD5H2F35I3LN-based systems.

- Compliance: Ensure compliance with industry standards and regulations governing telecommunications equipment, including electromagnetic compatibility (EMC) and radio frequency (RF) emissions.

- Scalability: Design the system with scalability in mind to accommodate future upgrades and enhancements in 5G technology and network infrastructure.

5SGSMD5H2F35I3LN FAQ

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6. What is the process for return or replacement of 5SGSMD5H2F35I3LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD5H2F35I3LN we delivered, we will accept the replacement or return of the 5SGSMD5H2F35I3LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD5H2F35I3LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations