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Name: 5SGSMD4H3F35I3LG
Brand: Intel
SKU: 5SGSMD4H3F35I3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD4H3F35I3LG

Part No.:: 5SGSMD4H3F35I3LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 2003

Quantity:: Add To Cart

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5SGSMD4H3F35I3LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Active
NumberofLABs/CLBs:
135840
NumberofLogicElements/Cells:
360000
TotalRAMBits:
19456000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGSMD4H3F35I3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD4H3F35I3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD4H3F35I3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD4H3F35I3LG information

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5SGSMD4H3F35I3LG Application Introduction

5SGSMD4H3F35I3LG is an FPGA chip offering high-performance computing capabilities, ideal for complex digital designs and embedded systems. It features a rich set of logic elements, memory resources, and advanced I/O capabilities.

Application Scenario:

In high-speed data processing systems, this chip can be utilized for tasks such as real-time signal processing, data encryption, and protocol bridging.

Circuit Design:

To design a high-speed data processing system using 5SGSMD4H3F35I3LG, follow these steps:

1. Power Management:

Ensure a stable and clean power supply for 5SGSMD4H3F35I3LG. Use low-noise voltage regulators and place decoupling capacitors close to the power pins to minimize voltage fluctuations and noise. Proper power sequencing is crucial to prevent damage to the chip.

2. Signal Integrity:

Design the PCB layout with controlled impedance traces to maintain signal integrity. Pay attention to trace lengths and routing to minimize signal skew and reflections. Use differential signaling for high-speed interfaces and keep traces as short as possible.

3. Thermal Management:

Implement efficient thermal management strategies. Use heat sinks, thermal vias, and proper airflow to dissipate heat generated by 5SGSMD4H3F35I3LG. Ensure the operating temperature remains within the recommended range to avoid performance degradation or damage.

4. Memory Interface:

Connect external memory devices, like DDR3 or DDR4, to the FPGA. Ensure proper termination and matching to avoid signal integrity issues. Configure the memory controller within the FPGA to optimize data throughput and latency.

5. I/O Configuration:

Configure the I/O pins of 5SGSMD4H3F35I3LG based on the peripheral requirements. Use appropriate I/O standards (e.g., LVDS, LVCMOS) and ensure proper pin assignment to match the PCB layout and design constraints.

Considerations:

When designing the system, it's essential to consider:

- Power Distribution: Ensure even distribution of power to avoid hot spots and voltage drops across the PCB.

- Signal Timing: Verify timing constraints and use timing analysis tools to ensure reliable operation at desired clock frequencies.

- Thermal Analysis: Conduct thermal analysis simulations to predict heat dissipation and ensure adequate cooling.

- EMC/EMI Compliance: Design the PCB layout and shielding to minimize electromagnetic interference and ensure compliance with relevant EMC standards.

- System Reliability: Test the system under various operating conditions to ensure robustness and reliability.

5SGSMD4H3F35I3LG FAQ

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3. Are the 5SGSMD4H3F35I3LG price and inventory displayed accurate?

The price and inventory of 5SGSMD4H3F35I3LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGSMD4H3F35I3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD4H3F35I3LG we delivered, we will accept the replacement or return of the 5SGSMD4H3F35I3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD4H3F35I3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations