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Name: 5SGSMD4H2F35C3N
Brand: Intel
SKU: 5SGSMD4H2F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGSMD4H2F35C3N

Part No.:: 5SGSMD4H2F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGSMD4H2F35C3N.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 2492

Quantity:: Add To Cart

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5SGSMD4H2F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
135840
NumberofLogicElements/Cells:
360000
TotalRAMBits:
19456000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGSMD4H2F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD4H2F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD4H2F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD4H2F35C3N information

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The application and technological advancement of 5SGSMD4H2F35C3N in specific industries

5SGSMD4H2F35C3N is a highly advanced field-programmable gate array (FPGA) chip designed by Intel. Its cutting-edge features and capabilities make it a game-changer in various industries, revolutionizing standard practices and elevating technological standards.

Application Scenario:

In the telecommunications industry, 5SGSMD4H2F35C3N finds extensive use in the development of high-speed, reliable networking equipment. Its unparalleled processing power and flexibility enable the creation of next-generation routers and switches capable of handling massive data volumes with minimal latency.

Circuit Design:

To harness the power of 5SGSMD4H2F35C3N in telecommunications infrastructure, the circuit design process follows these critical steps:

1. High-Speed Data Processing:

Integrate 5SGSMD4H2F35C3N into the circuit board layout, ensuring optimal signal integrity and high-speed data pathways between the FPGA and external components such as Ethernet interfaces and memory modules.

2. Protocol Implementation:

Utilize the programmable logic capabilities of 5SGSMD4H2F35C3N to implement complex networking protocols such as Ethernet, MPLS, or IPv6, allowing for seamless interoperability and compatibility with existing network infrastructure.

3. Traffic Management:

Implement sophisticated traffic management algorithms within the FPGA fabric to prioritize data packets, ensure Quality of Service (QoS), and optimize network performance even under heavy traffic loads.

4. Security Features:

Utilize the advanced security features of 5SGSMD4H2F35C3N, including encryption and authentication capabilities, to safeguard sensitive data and protect against cyber threats such as DDoS attacks or data breaches.

5. Scalability and Flexibility:

Design the circuit with scalability in mind, allowing for future expansion and upgrades by leveraging the reconfigurable nature of 5SGSMD4H2F35C3N to adapt to evolving network requirements and technologies.

Considerations:

When designing circuits with 5SGSMD4H2F35C3N, several considerations are crucial to ensuring optimal performance and reliability:

- Thermal Management: Implement effective heat dissipation mechanisms to prevent overheating and ensure stable operation of the FPGA chip, especially in high-performance networking equipment deployed in data centers or telecommunications hubs.

- Power Efficiency: Optimize power consumption by employing dynamic power management techniques and low-power design strategies, maximizing energy efficiency and reducing operating costs over the lifespan of the circuit.

- Signal Integrity: Pay close attention to signal integrity issues such as impedance matching, signal routing, and electromagnetic interference (EMI) mitigation to maintain robust data transmission and minimize the risk of signal degradation or corruption.

- Compliance and Standards: Ensure compliance with industry standards and regulations governing telecommunications equipment, such as FCC regulations or ITU-T recommendations, to guarantee interoperability and legal compliance in global markets.

- Reliability and Testing: Conduct rigorous testing and validation procedures to verify the functionality, performance, and reliability of the circuit design, including simulation-based testing, hardware-in-the-loop (HIL) testing, and field trials under real-world operating conditions.

5SGSMD4H2F35C3N FAQ

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3. Are the 5SGSMD4H2F35C3N price and inventory displayed accurate?

The price and inventory of 5SGSMD4H2F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSMD4H2F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD4H2F35C3N we delivered, we will accept the replacement or return of the 5SGSMD4H2F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD4H2F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations