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Name: 5SGSMD3H3F35C4WN
Brand: Intel
SKU: 5SGSMD3H3F35C4WN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD3H3F35C4WN

Part No.:: 5SGSMD3H3F35C4WN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 2163

Quantity:: Add To Cart

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5SGSMD3H3F35C4WN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
89000
NumberofLogicElements/Cells:
236000
TotalRAMBits:
13312000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGSMD3H3F35C4WN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD3H3F35C4WN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD3H3F35C4WN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD3H3F35C4WN information

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Market and Application Analysis of 5SGSMD3H3F35C4WN

5SGSMD3H3F35C4WN is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Intel (formerly Altera). It belongs to the Intel Stratix 5 series and is designed for demanding applications requiring high-speed data processing and complex logic implementations.

Market Positioning:

In the rapidly evolving landscape of telecommunications, networking, and data centers, 5SGSMD3H3F35C4WN holds a strategic position. Its advanced architecture, featuring a combination of programmable logic, high-speed transceivers, and embedded memory, caters to applications demanding real-time processing, low latency, and high bandwidth.

Application Areas:

1. 5SGSMD3H3F35C4WN finds extensive use in telecommunications infrastructure, where it powers the backbone of networks, facilitating data transmission, protocol handling, and signal processing with its parallel computing capabilities.

2. In the aerospace and defense sector, 5SGSMD3H3F35C4WN is deployed in radar systems, communication systems, and electronic warfare platforms, leveraging its high performance and reliability to meet stringent requirements.

3. Data centers rely on 5SGSMD3H3F35C4WN for accelerating data processing tasks, such as packet routing, encryption, and compression, contributing to the efficient operation of cloud computing and big data analytics.

4. Industrial automation benefits from 5SGSMD3H3F35C4WN's flexibility and reconfigurability, enabling the implementation of custom control algorithms, image processing, and machine vision systems.

5. Automotive applications, including advanced driver assistance systems (ADAS) and autonomous driving, harness the computational power of 5SGSMD3H3F35C4WN for sensor fusion, real-time decision making, and vehicle-to-vehicle communication.

Competitive Edge:

- 5SGSMD3H3F35C4WN stands out in the FPGA market due to its combination of high logic density, high-speed transceivers, and embedded memory resources, offering unmatched performance for mission-critical applications.

- Its advanced architecture allows for efficient parallel processing, enabling developers to implement complex algorithms and achieve superior throughput compared to traditional microprocessors.

- Intel's comprehensive development tools and ecosystem support streamline the design process, empowering engineers to unleash the full potential of 5SGSMD3H3F35C4WN in diverse applications.

- The chip's robustness and reliability make it a preferred choice for applications where system uptime and data integrity are paramount, providing a competitive advantage in demanding environments.

Potential Impact on Industry:

As 5SGSMD3H3F35C4WN continues to push the boundaries of performance and versatility, its adoption is expected to catalyze innovation across various industries:

- Telecommunications and networking infrastructure will witness enhanced throughput and scalability, paving the way for the rapid deployment of 5G networks and beyond.

- In aerospace and defense, the chip's reliability and radiation tolerance will support the development of next-generation avionics systems and satellite payloads, ensuring robust communication and navigation capabilities.

- Data centers will benefit from increased efficiency and reduced latency, enabling real-time analytics, artificial intelligence, and high-performance computing applications to drive insights and business value.

- Industrial automation will see advancements in robotics, industrial IoT, and smart manufacturing, empowering businesses to optimize processes, improve quality control, and adapt to dynamic market demands.

- Automotive innovation will accelerate with the integration of 5SGSMD3H3F35C4WN into advanced driver assistance systems and autonomous vehicles, enhancing safety, efficiency, and connectivity on the road.

Conclusion:

With its cutting-edge capabilities and robust architecture, 5SGSMD3H3F35C4WN emerges as a key enabler of technological progress across a wide spectrum of industries. As demand for high-performance computing solutions continues to grow, the chip's impact on application development and industry evolution is set to expand, driving innovation and shaping the future of technology.

5SGSMD3H3F35C4WN FAQ

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The price and inventory of 5SGSMD3H3F35C4WN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGSMD3H3F35C4WN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD3H3F35C4WN we delivered, we will accept the replacement or return of the 5SGSMD3H3F35C4WN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD3H3F35C4WN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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