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Name: 5SGSMD3H2F35I3LN
Brand: Intel
SKU: 5SGSMD3H2F35I3LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD3H2F35I3LN

Part No.:: 5SGSMD3H2F35I3LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGSMD3H2F35I3LN.pdf

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3523

Quantity:: Add To Cart

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5SGSMD3H2F35I3LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
89000
NumberofLogicElements/Cells:
236000
TotalRAMBits:
13312000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGSMD3H2F35I3LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD3H2F35I3LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD3H2F35I3LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD3H2F35I3LN information

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The application and technological advancement of 5SGSMD3H2F35I3LN in specific industries

5SGSMD3H2F35I3LN is a high-performance FPGA (Field-Programmable Gate Array) chip known for its versatility and efficiency in various applications, particularly in the field of telecommunications, automotive, aerospace, industrial automation, and medical devices.

Application Scenario:

In the telecommunications industry, 5SGSMD3H2F35I3LN plays a pivotal role in the development of next-generation network infrastructure, including 5G base stations, optical transport networks, and edge computing platforms.

Circuit Design:

To harness the power of 5SGSMD3H2F35I3LN in telecommunications applications, designers follow these essential steps:

1. Protocol Implementation:

Implement communication protocols such as Ethernet, CPRI (Common Public Radio Interface), and JESD204B (JEDEC Standard for Data Converters) to enable seamless data transfer and synchronization between network elements. Utilize the advanced DSP (Digital Signal Processing) capabilities of 5SGSMD3H2F35I3LN to support high-speed data processing and modulation/demodulation functions.

2. Signal Processing:

Utilize the FPGA's reconfigurable logic resources to implement custom signal processing algorithms for tasks such as beamforming, equalization, and error correction in wireless communication systems. Leverage the high-speed transceivers and parallel processing capabilities of 5SGSMD3H2F35I3LN to handle massive data streams with low latency.

3. Interface Integration:

Integrate various interface standards such as PCIe (Peripheral Component Interconnect Express), DDR (Double Data Rate) memory interfaces, and high-speed serial interfaces (e.g., SERDES) to facilitate connectivity with external components such as RF transceivers, memory modules, and application-specific processors. Customize the FPGA's I/O (Input/Output) configuration to match the requirements of specific interface protocols and data rates.

4. System Optimization:

Optimize the FPGA design for power efficiency, resource utilization, and timing constraints to meet the stringent requirements of telecommunications systems. Utilize advanced synthesis and place-and-route tools to achieve high performance and reliability while minimizing development time and cost.

5. Verification and Testing:

Rigorously test the FPGA design using simulation, emulation, and hardware-in-the-loop (HIL) testing techniques to ensure functional correctness, performance, and reliability under various operating conditions and stress scenarios. Conduct interoperability testing with other network elements and equipment to validate compatibility and compliance with industry standards.

Considerations:

When designing FPGA-based solutions for telecommunications applications, it's essential to consider factors such as:

- Compliance: Ensure compliance with industry standards and regulations such as 3GPP (3rd Generation Partnership Project) specifications for wireless communication systems and IEEE (Institute of Electrical and Electronics Engineers) standards for networking protocols.

- Security: Implement robust security features such as encryption, authentication, and secure boot mechanisms to protect sensitive data and prevent unauthorized access or tampering.

- Scalability: Design the FPGA-based solution to scale seamlessly with evolving network requirements, supporting future enhancements such as higher data rates, increased capacity, and new functionality without requiring significant redesign or hardware upgrades.

- Reliability: Employ fault-tolerant design techniques such as redundancy, error detection, and error correction to ensure reliable operation and minimize the risk of service disruptions or downtime.

- Interoperability: Ensure interoperability with legacy systems and equipment by supporting backward compatibility and providing migration paths for smooth transition to new technologies and standards.

5SGSMD3H2F35I3LN FAQ

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6. What is the process for return or replacement of 5SGSMD3H2F35I3LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD3H2F35I3LN we delivered, we will accept the replacement or return of the 5SGSMD3H2F35I3LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD3H2F35I3LN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations