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Name: 5SGSMD3H1F35C2G
Brand: Intel
SKU: 5SGSMD3H1F35C2G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD3H1F35C2G

Part No.:: 5SGSMD3H1F35C2G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 432 I/O 1152FBGA

In Stock:: 3982

Quantity:: Add To Cart

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5SGSMD3H1F35C2G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Active
NumberofLABs/CLBs:
89000
NumberofLogicElements/Cells:
236000
TotalRAMBits:
13312000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGSMD3H1F35C2G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD3H1F35C2G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD3H1F35C2G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD3H1F35C2G information

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The working principle and core technical features of 5SGSMD3H1F35C2G

5SGSMD3H1F35C2G is a powerful FPGA (Field-Programmable Gate Array) from the Intel Stratix V family, designed to deliver high performance and flexibility for complex applications. It features advanced processing capabilities, high-speed transceivers, and extensive I/O options.

Application Scenario:

In telecommunications, this chip can be used to implement high-speed data processing and signal modulation in base stations, ensuring efficient data transmission and reception.

Working Principles:

The 5SGSMD3H1F35C2G operates on a reconfigurable hardware architecture, allowing users to program custom logic circuits. It includes high-speed transceivers for data rates up to 28 Gbps, DSP blocks for intensive computations, and memory blocks for data storage.

Core Technical Features:

1. High-Speed Transceivers:

The chip's high-speed transceivers support a variety of protocols, including Ethernet, PCIe, and Serial RapidIO. These transceivers enable efficient data transfer between devices and systems.

2. DSP Blocks:

The integrated DSP blocks provide the necessary computational power for signal processing tasks. These blocks can perform multiply-accumulate operations, which are essential for applications like digital filtering and modulation.

3. Memory Blocks:

The on-chip memory blocks offer flexible storage options, including RAM and ROM. These memory resources can be used for buffering data, storing configuration settings, and caching frequently accessed information.

Application Effects and Technical Advantages:

In telecommunications, using the 5SGSMD3H1F35C2G enhances system performance by enabling high-speed data processing and reducing latency. Its reconfigurable nature allows for rapid adaptation to changing communication standards and protocols, ensuring long-term viability and efficiency.

Enhancing System Performance and Efficiency:

To maximize the benefits of this chip, consider the following strategies:

1. Optimized Logic Design:

Develop efficient logic designs that minimize resource usage and maximize processing speed. Use hardware description languages (HDLs) like VHDL or Verilog for precise control over the chip's functionality.

2. Efficient Power Management:

Implement power management techniques to reduce power consumption without compromising performance. This can include dynamic voltage and frequency scaling (DVFS) and power gating.

3. Signal Integrity:

Ensure robust signal integrity by designing appropriate PCB layouts and using differential signaling for high-speed data paths. This helps in minimizing noise and crosstalk, which are crucial for maintaining data integrity at high speeds.

4. Thermal Management:

Employ effective thermal management solutions, such as heatsinks and active cooling systems, to dissipate heat generated by the chip. This ensures reliable operation and prolongs the lifespan of the device.

Conclusion:

The 5SGSMD3H1F35C2G FPGA is a versatile and powerful solution for high-performance applications, particularly in telecommunications. Its advanced features and reconfigurable architecture provide significant advantages in terms of speed, flexibility, and efficiency. By optimizing design and implementation strategies, the overall system performance and efficiency can be greatly enhanced.

5SGSMD3H1F35C2G FAQ

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3. Are the 5SGSMD3H1F35C2G price and inventory displayed accurate?

The price and inventory of 5SGSMD3H1F35C2G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSMD3H1F35C2G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD3H1F35C2G we delivered, we will accept the replacement or return of the 5SGSMD3H1F35C2G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD3H1F35C2G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations