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Name: 5SGSMD3E2H29I3LG
Brand: Intel
SKU: 5SGSMD3E2H29I3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGSMD3E2H29I3LG

Part No.:: 5SGSMD3E2H29I3LG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 360 I/O 780HBGA

In Stock:: 2882

Quantity:: Add To Cart

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5SGSMD3E2H29I3LG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Active
NumberofLABs/CLBs:
89000
NumberofLogicElements/Cells:
236000
TotalRAMBits:
13312000
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGSMD3E2H29I3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSMD3E2H29I3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSMD3E2H29I3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSMD3E2H29I3LG information

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5SGSMD3E2H29I3LG Application Introduction

5SGSMD3E2H29I3LG is an FPGA chip with advanced features, widely used in high-performance computing and signal processing applications. It offers high-speed I/O, extensive logic resources, and efficient power management.

Application Scenario:

In telecommunications, this chip can be used to implement high-speed data processing and signal modulation/demodulation systems, enhancing network throughput and reliability.

Design Optimization Tips:

1. Power Management:

Effective power management is crucial for maintaining system stability and efficiency. For 5SGSMD3E2H29I3LG:

- Use low-dropout (LDO) regulators or switching regulators to provide stable power supplies. Ensure that the voltage levels are within the specifications to avoid damaging the chip.

- Implement power gating techniques to disable unused logic blocks, reducing power consumption during idle periods.

- Employ dynamic voltage and frequency scaling (DVFS) to adjust the power levels based on the processing demands, optimizing power usage.

2. Signal Integrity:

Maintaining signal integrity is essential for reliable data transmission. For 5SGSMD3E2H29I3LG:

- Design PCB traces with controlled impedance to minimize reflections and signal loss. Use differential signaling for high-speed data lines to reduce electromagnetic interference (EMI).

- Place decoupling capacitors close to the power pins of the chip to filter out noise and provide a stable power supply.

- Route high-speed signals away from noisy components and use ground planes to shield sensitive signals.

3. Thermal Management:

Proper thermal management ensures the chip operates within safe temperature ranges. For 5SGSMD3E2H29I3LG:

- Use heatsinks or thermal pads to dissipate heat generated by the chip, especially in high-power applications.

- Ensure adequate airflow around the chip by designing the enclosure with ventilation slots or using fans for active cooling.

- Monitor the temperature using on-chip sensors and implement thermal shutdown mechanisms to protect the chip from overheating.

Considerations:

When designing with 5SGSMD3E2H29I3LG, consider the following aspects:

- Power Distribution Network (PDN): Design an efficient PDN to ensure consistent power delivery across the FPGA. Use power planes and multiple vias to reduce impedance and improve current flow.

- Timing Analysis: Perform thorough timing analysis to ensure that all signals meet the setup and hold time requirements. Use timing constraints and optimization tools provided by the FPGA design software.

- Testing and Debugging: Implement test points and use debugging tools to verify the functionality and performance of the FPGA design. Consider boundary-scan (JTAG) testing for thorough testing of the interconnections.

- Compliance with Standards: Ensure that the design complies with relevant industry standards for EMI/EMC, signal integrity, and thermal performance.

By following these design optimization tips, you can effectively utilize the capabilities of 5SGSMD3E2H29I3LG in your high-performance computing and signal processing projects, ensuring efficient power management, signal integrity, and thermal stability.

5SGSMD3E2H29I3LG FAQ

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3. Are the 5SGSMD3E2H29I3LG price and inventory displayed accurate?

The price and inventory of 5SGSMD3E2H29I3LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSMD3E2H29I3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSMD3E2H29I3LG we delivered, we will accept the replacement or return of the 5SGSMD3E2H29I3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSMD3E2H29I3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations