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Name: 5SGSED6N2F45C2
Brand: Intel
SKU: 5SGSED6N2F45C2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGSED6N2F45C2

Part No.:: 5SGSED6N2F45C2

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGSED6N2F45C2.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 3277

Quantity:: Add To Cart

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5SGSED6N2F45C2 Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GS
ProductStatus:
Obsolete
NumberofLABs/CLBs:
220000
NumberofLogicElements/Cells:
583000
TotalRAMBits:
46080000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGSED6N2F45C2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGSED6N2F45C2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGSED6N2F45C2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGSED6N2F45C2 information

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5SGSED6N2F45C2 Application Introduction

5SGSED6N2F45C2 is a versatile field-programmable gate array (FPGA) device commonly used in high-performance computing and signal processing applications. It offers a high logic density, low power consumption, and configurable I/O capabilities, making it suitable for a wide range of design projects.

Power Management:

To optimize power management in a design utilizing 5SGSED6N2F45C2, consider the following techniques:

1. Power Supply:

Ensure a stable and clean power supply to 5SGSED6N2F45C2 by utilizing high-quality voltage regulators and decoupling capacitors. Pay attention to power sequencing requirements specified in the datasheet to prevent potential issues during startup and operation.

2. Dynamic Voltage and Frequency Scaling (DVFS):

Implement DVFS techniques to dynamically adjust the operating voltage and frequency of 5SGSED6N2F45C2 based on workload demands. This can help optimize power consumption without sacrificing performance.

3. Clock Gating:

Utilize clock gating techniques to disable clocks to unused logic elements or modules within 5SGSED6N2F45C2 during idle or low activity periods. This can significantly reduce dynamic power consumption.

Signal Integrity:

Ensuring signal integrity is crucial for reliable operation in designs incorporating 5SGSED6N2F45C2. Follow these guidelines to optimize signal integrity:

1. Transmission Line Design:

Implement controlled impedance transmission lines for high-speed signals to minimize reflections and signal distortion. Pay attention to routing length matching and impedance matching to maintain signal integrity.

2. Signal Termination:

Apply appropriate termination techniques, such as series resistors or termination resistors, to match the impedance of the transmission line and reduce signal reflections.

3. Crosstalk Mitigation:

Isolate sensitive signal traces and minimize coupling between adjacent traces to prevent crosstalk-induced signal corruption. Utilize ground and power planes for signal shielding and noise reduction.

Thermal Management:

Effective thermal management is essential to prevent overheating and ensure the reliability of 5SGSED6N2F45C2-based designs. Consider the following strategies:

1. Heat Dissipation:

Design the PCB layout to facilitate efficient heat dissipation from 5SGSED6N2F45C2 by providing thermal vias, heat sinks, or thermal pads connected to a ground plane for effective heat transfer.

2. Thermal Simulation:

Conduct thermal simulations to identify hot spots and optimize component placement and airflow within the enclosure. Ensure adequate ventilation and cooling mechanisms are in place to maintain temperature within acceptable limits.

3. Operating Conditions:

Operate 5SGSED6N2F45C2 within its specified temperature range and avoid prolonged exposure to extreme temperatures. Monitor temperature levels during operation and implement thermal shutdown mechanisms if necessary to prevent damage due to overheating.

Conclusion:

By implementing effective power management, optimizing signal integrity, and employing proper thermal management techniques, designers can maximize the performance, reliability, and longevity of designs utilizing 5SGSED6N2F45C2.

5SGSED6N2F45C2 FAQ

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3. Are the 5SGSED6N2F45C2 price and inventory displayed accurate?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGSED6N2F45C2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGSED6N2F45C2 we delivered, we will accept the replacement or return of the 5SGSED6N2F45C2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGSED6N2F45C2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations